TREA

Iwao Takahashi

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding load measuring device
    • Patent number 5,633,469
    • Issue date May 27, 1997
    • Kabushiki Kaisha Shinkawa
    • Iwao Takahashi
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Wire bonding method and apparatus
    • Patent number 5,616,257
    • Issue date Apr 1, 1997
    • Kabushiki Kaisha Shinkawa
    • Koichi Harada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Carrier receiving device for bonding machines
    • Patent number 5,032,055
    • Issue date Jul 16, 1991
    • Kabushiki Kaisha Shinkawa
    • Yasunobu Suzuki
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL