Izuru Komatsu

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Power module
- Patent number 12,107,023
- Issue date Oct 1, 2024
- Kabushiki Kaisha Toshiba
- Keiichiro Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated body including resin body and gel body and method for pro...
- Patent number 11,795,317
- Issue date Oct 24, 2023
- Osaka University
- Yuji Ohkubo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Housing, electronic device, method for manufacturing housing, and m...
- Patent number 11,229,129
- Issue date Jan 18, 2022
- Kabushiki Kaisha Toshiba
- Izuru Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure, wiring board, substrate for wiring board, copper clad la...
- Patent number 10,912,193
- Issue date Feb 2, 2021
- Kabushiki Kaisha Toshiba
- Hajime Nakashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Illuminating device
- Patent number 8,643,264
- Issue date Feb 4, 2014
- Kabushiki Kaisha Toshiba
- Hideo Nishiuchi
- F21 - LIGHTING
Information Patent Grant
Luminaire
- Patent number 8,618,723
- Issue date Dec 31, 2013
- Toshiba Lighting & Technology Corporation
- Makoto Sakai
- F21 - LIGHTING
Information Patent Grant
Optical semiconductor device and method of manufacturing optical se...
- Patent number 8,241,937
- Issue date Aug 14, 2012
- Kabushiki Kaisha Toshiba
- Akihiko Happoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor device and method of manufacturing optical se...
- Patent number 8,039,857
- Issue date Oct 18, 2011
- Kabushiki Kaisha Toshiba
- Akihiko Happoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting flux and solder paste
- Patent number 7,604,154
- Issue date Oct 20, 2009
- Kabushiki Kaisha Toshiba
- Kazutaka Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting material, semiconductor device and method of manufacturing...
- Patent number 6,949,814
- Issue date Sep 27, 2005
- Kabushiki Kaisha Toshiba
- Cao Minh Thai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material, device using the same and manufacturing process th...
- Patent number 6,673,310
- Issue date Jan 6, 2004
- Kabushiki Kaisha Toshiba
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering method and soldering apparatus
- Patent number 6,464,122
- Issue date Oct 15, 2002
- Kuroda Techno Co., Ltd.
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material and method of manufacturing solder material
- Patent number 6,386,426
- Issue date May 14, 2002
- Kabushiki Kaisha Toshiba
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of joining metallic members, and joined metallic members
- Patent number 6,220,501
- Issue date Apr 24, 2001
- Kabushiki Kaisha Toshiba
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material and method of manufacturing solder material
- Patent number 6,186,390
- Issue date Feb 13, 2001
- Kabushiki Kaisha Toshiba
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering method and soldering apparatus
- Patent number 6,123,248
- Issue date Sep 26, 2000
- Kabushiki Kaisha Toshiba
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312947
- Publication date Sep 19, 2024
- Kabushiki Kaisha Toshiba
- Tomohiro IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED BODY INCLUDING RESIN BODY AND GEL BODY AND METHOD FOR PRO...
- Publication number 20230167292
- Publication date Jun 1, 2023
- OSAKA UNIVERSITY
- Yuji OHKUBO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POWER MODULE
- Publication number 20220262690
- Publication date Aug 18, 2022
- Kabushiki Kaisha Toshiba
- Keiichiro MATSUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOUSING, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING HOUSING, AND M...
- Publication number 20210120684
- Publication date Apr 22, 2021
- Kabushiki Kaisha Toshiba
- Izuru KOMATSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHTING APPARATUS
- Publication number 20150077993
- Publication date Mar 19, 2015
- KABUSHIKI KAISHA TOSHIBA
- Kakeru YAMAGUCHI
- F21 - LIGHTING
Information Patent Application
Lighting Device
- Publication number 20140003057
- Publication date Jan 2, 2014
- Toshiba Lighting & Technology Corporation
- Daigo Suzuki
- F21 - LIGHTING
Information Patent Application
ILLUMINATING DEVICE
- Publication number 20130070457
- Publication date Mar 21, 2013
- Kabushiki Kaisha Toshiba
- Hideo NISHIUCHI
- F21 - LIGHTING
Information Patent Application
LUMINAIRE
- Publication number 20130063942
- Publication date Mar 14, 2013
- Kabushiki Kaisha Toshiba
- Makoto SAKAI
- F21 - LIGHTING
Information Patent Application
LIGHTING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130063957
- Publication date Mar 14, 2013
- Kabushiki Kaisha Toshiba
- Makoto SAKAI
- F21 - LIGHTING
Information Patent Application
LIGHTING APPARATUS
- Publication number 20120218737
- Publication date Aug 30, 2012
- Kabushiki Kaisha Toshiba
- Izuru Komatsu
- F21 - LIGHTING
Information Patent Application
LIGHTING DEVICE
- Publication number 20120212959
- Publication date Aug 23, 2012
- Kabushiki Kaisha Toshiba
- Michinobu INOUE
- F21 - LIGHTING
Information Patent Application
OPTICAL SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING OPTICAL SE...
- Publication number 20110312110
- Publication date Dec 22, 2011
- KABUSHIKI KAISHA TOSHIBA
- Akihiko HAPPOYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING OPTICAL SE...
- Publication number 20100140639
- Publication date Jun 10, 2010
- Kabushiki Kaisha Toshiba
- Akihiko HAPPOYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE, OPTICAL SEMIC...
- Publication number 20100006888
- Publication date Jan 14, 2010
- Kabushiki Kaisha Toshiba
- Naotake WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF
- Publication number 20080073794
- Publication date Mar 27, 2008
- Kabushiki Kaisha Toshiba
- Susumu Obata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING FLUX AND SOLDER PASTE
- Publication number 20070221712
- Publication date Sep 27, 2007
- Kabushiki Kaisha Toshiba
- Kazutaka Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldered material, semiconductor device, method of soldering, and m...
- Publication number 20060081995
- Publication date Apr 20, 2006
- Kabushiki Kaisha Toshiba
- Toshihide Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead free solder
- Publication number 20060067853
- Publication date Mar 30, 2006
- Kabushiki Kaisha Toshiba
- Toshihide Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldered material, semiconductor device, method of soldering, and m...
- Publication number 20050218525
- Publication date Oct 6, 2005
- Kabushiki Kaisha Toshiba
- Toshihide Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermosetting flux and solder paste
- Publication number 20050056687
- Publication date Mar 17, 2005
- Kabushiki Kaisha Toshiba
- Kazutaka Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-free joining material and joining method using the same
- Publication number 20040096688
- Publication date May 20, 2004
- Kabushiki Kaisha Toshiba
- Masahiro Tadauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting material, semiconductor device and method of manufacturing...
- Publication number 20030111728
- Publication date Jun 19, 2003
- Cao Minh Thai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder material, device using the same and manufacturing process th...
- Publication number 20010029095
- Publication date Oct 11, 2001
- Masahiro Tadauchi
- H01 - BASIC ELECTRIC ELEMENTS

Izuru Komatsu

Person

Patents Grantslast 30 patents

Power module

Laminated body including resin body and gel body and method for pro...

Housing, electronic device, method for manufacturing housing, and m...

Structure, wiring board, substrate for wiring board, copper clad la...

Illuminating device

Luminaire

Optical semiconductor device and method of manufacturing optical se...

Optical semiconductor device and method of manufacturing optical se...

Thermosetting flux and solder paste

Mounting material, semiconductor device and method of manufacturing...

Solder material, device using the same and manufacturing process th...

Soldering method and soldering apparatus

Solder material and method of manufacturing solder material

Method of joining metallic members, and joined metallic members

Solder material and method of manufacturing solder material

Soldering method and soldering apparatus

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

LAMINATED BODY INCLUDING RESIN BODY AND GEL BODY AND METHOD FOR PRO...

POWER MODULE

HOUSING, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING HOUSING, AND M...

LIGHTING APPARATUS

Lighting Device

ILLUMINATING DEVICE

LUMINAIRE

LIGHTING DEVICE AND MANUFACTURING METHOD THEREOF

LIGHTING APPARATUS

LIGHTING DEVICE

OPTICAL SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING OPTICAL SE...

OPTICAL SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING OPTICAL SE...

METHOD OF MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE, OPTICAL SEMIC...

SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF

THERMOSETTING FLUX AND SOLDER PASTE

Soldered material, semiconductor device, method of soldering, and m...

Lead free solder

Soldered material, semiconductor device, method of soldering, and m...

Thermosetting flux and solder paste

Lead-free joining material and joining method using the same

Mounting material, semiconductor device and method of manufacturing...

Solder material, device using the same and manufacturing process th...