J. B. Chyi

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Sinshih Township, TW

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Patents Applicationslast 30 patents

Information Patent Application
PACKAGING CONDUCTIVE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110143531
- Publication date Jun 16, 2011
- J. B. CHYI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging conductive structure and method for manufacturing the same
- Publication number 20080197489
- Publication date Aug 21, 2008
- ChipMOS TECHNOLOGIES INC.
- J. B. Chyi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive structure for a semiconductor integrated circuit and met...
- Publication number 20080197467
- Publication date Aug 21, 2008
- ChipMOS TECHNOLOGIES INC.
- J.B. Chyi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive structure for a semiconductor integrated circuit and met...
- Publication number 20080197490
- Publication date Aug 21, 2008
- ChipMOS TECHNOLOGIES INC.
- J. B. Chyi
- H01 - BASIC ELECTRIC ELEMENTS