J. Campbell Scott

Person

Los Gatos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dislocation engineering using a scanned laser
- Patent number 8,865,571
- Issue date Oct 21, 2014
- International Business Machines Corporation
- Chung Woh Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dislocation engineering using a scanned laser
- Patent number 8,865,572
- Issue date Oct 21, 2014
- International Business Machines Corporation
- Chung Woh Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dislocation engineering using a scanned laser
- Patent number 8,138,066
- Issue date Mar 20, 2012
- International Business Machines Corporation
- Chung Woh Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser annealing for 3-D chip integration
- Patent number 8,138,085
- Issue date Mar 20, 2012
- International Business Machines Corporation
- Howard H. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser annealing for 3-D chip integration
- Patent number 7,947,599
- Issue date May 24, 2011
- International Business Machines Corporation
- Howard H. Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISLOCATION ENGINEERING USING A SCANNED LASER
- Publication number 20140154872
- Publication date Jun 5, 2014
- International Business Machines Corporation
- Chung Woh Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISLOCATION ENGINEERING USING A SCANNED LASER
- Publication number 20140154873
- Publication date Jun 5, 2014
- International Business Machines Corporation
- Chung Woh Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dislocation Engineering Using a Scanned Laser
- Publication number 20120294322
- Publication date Nov 22, 2012
- International Business Machines Corporation
- Chung Woh Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dislocation Engineering Using a Scanned Laser
- Publication number 20120138823
- Publication date Jun 7, 2012
- International Business Machines Corporation
- Chung Woh Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ANNEALING FOR 3-D CHIP INTEGRATION
- Publication number 20110201199
- Publication date Aug 18, 2011
- International Business Machines Corporation
- Howard H. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISLOCATION ENGINEERING USING A SCANNED LASER
- Publication number 20100081259
- Publication date Apr 1, 2010
- International Business Machines Corporation
- Chung Woh Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ANNEALING FOR 3-D CHIP INTEGRATION
- Publication number 20090184264
- Publication date Jul 23, 2009
- International Business Machines Corporation
- Howard H. Chen
- H01 - BASIC ELECTRIC ELEMENTS

J. Campbell Scott

Person

Patents Grantslast 30 patents

Dislocation engineering using a scanned laser

Dislocation engineering using a scanned laser

Dislocation engineering using a scanned laser

Laser annealing for 3-D chip integration

Laser annealing for 3-D chip integration

Patents Applicationslast 30 patents

DISLOCATION ENGINEERING USING A SCANNED LASER

DISLOCATION ENGINEERING USING A SCANNED LASER

Dislocation Engineering Using a Scanned Laser

Dislocation Engineering Using a Scanned Laser

LASER ANNEALING FOR 3-D CHIP INTEGRATION

DISLOCATION ENGINEERING USING A SCANNED LASER

LASER ANNEALING FOR 3-D CHIP INTEGRATION