J. Daniel Mis

Person

Cary, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic structures including barrier layers and/or oxidation bar...
- Patent number 8,487,432
- Issue date Jul 16, 2013
- Amkor Technology, Inc.
- Glenn A. Rinne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead free alloy bump structure and fabrication method
- Patent number 7,994,043
- Issue date Aug 9, 2011
- Amkor Technology, Inc.
- J. Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder structures including barrier layers with nickel and/or copper
- Patent number 7,839,000
- Issue date Nov 23, 2010
- Unitive International Limited
- J. Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic structures including barrier layers defining lips
- Patent number 7,834,454
- Issue date Nov 16, 2010
- Unitive International Limited
- Glenn A. Rinne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic devices including metallurgy structures for wire and sol...
- Patent number 7,665,652
- Issue date Feb 23, 2010
- Unitive International Limited
- J. Daniel Mis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive structures including titanium-tungsten base layers
- Patent number 7,550,849
- Issue date Jun 23, 2009
- Unitive International Limited
- J. Daniels Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming lead free solder bumps
- Patent number 7,547,623
- Issue date Jun 16, 2009
- Unitive International Limited
- J. Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming bumps using barrier layers as etch masks
- Patent number 7,427,557
- Issue date Sep 23, 2008
- Unitive International Limited
- Glenn A. Rinne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming solder bumps on exposed metal pads
- Patent number 7,358,174
- Issue date Apr 15, 2008
- Amkor Technology, Inc.
- J. Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive structures including titanium-tungste...
- Patent number 7,244,671
- Issue date Jul 17, 2007
- Unitive International Limited
- J. Daniels Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming metallurgy structures for wire and solder bonding
- Patent number 6,762,122
- Issue date Jul 13, 2004
- Unitivie International Limited
- J. Daniel Mis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Electronic Structures Including Barrier Layers and/or Oxidation Bar...
- Publication number 20110037171
- Publication date Feb 17, 2011
- Glenn A. Rinne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Structures Including Barrier Layers with Nickel and/or Copper
- Publication number 20090212427
- Publication date Aug 27, 2009
- UNITIVE INTERNATIONAL LIMITED
- J. Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Structures Including Barrier Layers Defining Lips
- Publication number 20080308931
- Publication date Dec 18, 2008
- UNITIVE INTERNATIONAL LIMITED
- Glenn A. Rinne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive Structures Including Titanium-Tungsten Base Layers
- Publication number 20070241460
- Publication date Oct 18, 2007
- UNITIVE INTERNATIONAL LIMITED
- J. Daniels Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming lead free solder bumps and related structures
- Publication number 20060030139
- Publication date Feb 9, 2006
- J. Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming solder bumps on exposed metal pads and related s...
- Publication number 20050245066
- Publication date Nov 3, 2005
- J. Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming bumps using barrier layers as etch masks and rel...
- Publication number 20050215045
- Publication date Sep 29, 2005
- Glenn A. Rinne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of forming conductive structures including titanium-tungste...
- Publication number 20050020047
- Publication date Jan 27, 2005
- J. Daniels Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic devices including metallurgy structures for wire and sol...
- Publication number 20040206801
- Publication date Oct 21, 2004
- J. Daniel Mis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of forming metallurgy structures for wire and solder bonding
- Publication number 20030057559
- Publication date Mar 27, 2003
- J. Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS

J. Daniel Mis

Person

Patents Grantslast 30 patents

Electronic structures including barrier layers and/or oxidation bar...

Lead free alloy bump structure and fabrication method

Solder structures including barrier layers with nickel and/or copper

Electronic structures including barrier layers defining lips

Electronic devices including metallurgy structures for wire and sol...

Conductive structures including titanium-tungsten base layers

Methods of forming lead free solder bumps

Methods of forming bumps using barrier layers as etch masks

Methods of forming solder bumps on exposed metal pads

Methods of forming conductive structures including titanium-tungste...

Methods of forming metallurgy structures for wire and solder bonding

Patents Applicationslast 30 patents

Electronic Structures Including Barrier Layers and/or Oxidation Bar...

Solder Structures Including Barrier Layers with Nickel and/or Copper

Electronic Structures Including Barrier Layers Defining Lips

Conductive Structures Including Titanium-Tungsten Base Layers

Methods of forming lead free solder bumps and related structures

Methods of forming solder bumps on exposed metal pads and related s...

Methods of forming bumps using barrier layers as etch masks and rel...

Methods of forming conductive structures including titanium-tungste...

Electronic devices including metallurgy structures for wire and sol...

Methods of forming metallurgy structures for wire and solder bonding