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J. Shelton Lewis

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  • Hillsboro, OR, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Via heat sink material
    • Patent number 7,592,702
    • Issue date Sep 22, 2009
    • Intel Corporation
    • J. Shelton Lewis
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Via heat sink material
    • Patent number 7,124,931
    • Issue date Oct 24, 2006
    • Intel Corporation
    • J. Shelton Lewis
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Integrated circuit package socket and socket contact
    • Patent number 7,104,803
    • Issue date Sep 12, 2006
    • Intel Corporation
    • Shawn L. Lloyd
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents