Ja Eun Yun

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Busan, KR

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package system with overhang die
- Patent number 8,956,914
- Issue date Feb 17, 2015
- Stats Chippac Ltd.
- Ja Eun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with package integration
- Patent number 8,067,275
- Issue date Nov 29, 2011
- Stats Chippac Ltd.
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with thermo-mechanical interlocki...
- Patent number 7,656,017
- Issue date Feb 2, 2010
- Stats Chippac Ltd.
- Hyun Joung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE INTEGRATION
- Publication number 20090155961
- Publication date Jun 18, 2009
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OVERHANG DIE
- Publication number 20090001613
- Publication date Jan 1, 2009
- Ja Eun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH THERMO-MECHANICAL INTERLOCKI...
- Publication number 20080142943
- Publication date Jun 19, 2008
- Hyun Joung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR