Jaber Derakhshandeh

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Leuven, BE

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Patents Grantslast 30 patents

Information Patent Grant
Method of direct bonding semiconductor components
- Patent number 11,810,892
- Issue date Nov 7, 2023
- Imec VZW
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the electrical bonding of semiconductor components
- Patent number 11,362,061
- Issue date Jun 14, 2022
- Imec VZW
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin NiB or CoB capping layer for non-noble metallic bonding landin...
- Patent number 10,066,303
- Issue date Sep 4, 2018
- Imec VZW
- Eric Beyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for self-aligned solder reflow bonding and devices obtained...
- Patent number 9,978,710
- Issue date May 22, 2018
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR BONDING AND INTERCONNECTING MICRO-ELECTRONIC COMPONENTS
- Publication number 20240203965
- Publication date Jun 20, 2024
- IMEC vzw
- Jaber Derakhshandeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Quantum Bit Chip and Method for Fabricating Quantum Bit Chip
- Publication number 20230200263
- Publication date Jun 22, 2023
- IMEC vzw
- Jaber Derakhshandeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR COMPONENTS
- Publication number 20210159207
- Publication date May 27, 2021
- IMEC vzw
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR THE ELECTRICAL BONDING OF SEMICONDUCTOR COMPONENTS
- Publication number 20200402950
- Publication date Dec 24, 2020
- IMEC vzw
- Lin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SELF-ALIGNED SOLDER REFLOW BONDING AND DEVICES OBTAINED...
- Publication number 20170194283
- Publication date Jul 6, 2017
- IMEC vzw
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN NIB OR COB CAPPING LAYER FOR NON-NOBLE METALLIC BONDING LANDIN...
- Publication number 20150247244
- Publication date Sep 3, 2015
- IMEC vzw
- Eric Beyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...