Jachson Hsieh

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Hsinchu Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Package structure for a photosensitive chip
- Patent number 6,590,269
- Issue date Jul 8, 2003
- Kingpak Technology Inc.
- Jason Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Photosensitive assembly with a transparent layer and method for man...
- Publication number 20040113218
- Publication date Jun 17, 2004
- Jachson Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for packaging image sensors
- Publication number 20030213124
- Publication date Nov 20, 2003
- Jason Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor
- Publication number 20030213891
- Publication date Nov 20, 2003
- Jason Chuang
- H01 - BASIC ELECTRIC ELEMENTS