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Jack Chocola
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Lake Mary, FL, US
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Patents Grants
last 30 patents
Information
Patent Grant
Wafer level packaging of materials with different coefficients of t...
Patent number
7,635,636
Issue date
Dec 22, 2009
Triquint Semiconductor, Inc.
Michael T. McClure
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Wafer-level surface acoustic wave filter package with temperature-c...
Patent number
7,230,512
Issue date
Jun 12, 2007
Triquint, Inc.
Charles Carpenter
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Method of forming a surface acoustic wave (SAW) filter device
Patent number
7,213,314
Issue date
May 8, 2007
Triquint, Inc.
Benjamin P. Abbott
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Wafer level packaging of materials with different coefficients of t...
Patent number
7,109,635
Issue date
Sep 19, 2006
Sawtek, Inc.
Michael T. McClure
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Saw filter device and method employing normal temperature bonding f...
Patent number
7,105,980
Issue date
Sep 12, 2006
Sawtek, Inc.
Benjamin P. Abbott
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Patents Applications
last 30 patents
Information
Patent Application
SAW Filter Device and Method Employing Normal Temperature Bonding f...
Publication number
20070028433
Publication date
Feb 8, 2007
Benjamin P. Abbott
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
Wafer Level Packaging of Materials with Different Coefficents of Th...
Publication number
20060263931
Publication date
Nov 23, 2006
Michael T. McClure
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
Saw filter device and method employing normal temperature bonding f...
Publication number
20040036381
Publication date
Feb 26, 2004
Benjamin P. Abbott
H03 - BASIC ELECTRONIC CIRCUITRY