Jack Deng

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Jhunan Township, TW

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Patents Grantslast 30 patents

Information Patent Grant
Image sensor
- Patent number 8,129,762
- Issue date Mar 6, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu-Tien Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor fabrication method and structure
- Patent number 7,507,598
- Issue date Mar 24, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fu-Tien Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microlens structure for improved CMOS image sensor sensitivity
- Patent number 7,505,206
- Issue date Mar 17, 2009
- Taiwan Semiconductor Manufacturing Company
- Jack Deng
- G02 - OPTICS
Information Patent Grant
Advance ridge structure for microlens gapless approach
- Patent number 7,264,976
- Issue date Sep 4, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jack Deng
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR
- Publication number 20090104547
- Publication date Apr 23, 2009
- Taiwan Semiconductor Manufacturing Co., LTD
- Fu-Tien Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL MICROLENS STRUCTURE FOR CIS SENSITIVITY IMPROVEMENT
- Publication number 20080007839
- Publication date Jan 10, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jack DENG
- G02 - OPTICS
Information Patent Application
Advance ridge structure for microlens gapless approach
- Publication number 20060189062
- Publication date Aug 24, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jack Deng
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Advanced cavity structure for wafer level chip scale package
- Publication number 20060131710
- Publication date Jun 22, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin Chen Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor fabrication method and structure
- Publication number 20060019424
- Publication date Jan 26, 2006
- Fu-Tien Weng
- H01 - BASIC ELECTRIC ELEMENTS