Jack Lai

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Hsin chu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Single semiconductor wafer transfer method and manufacturing system
- Patent number 5,976,199
- Issue date Nov 2, 1999
- United Microelectronics Corp.
- Hong-Jen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single semiconductor wafer transfer method and manufacturing system
- Patent number 5,668,056
- Issue date Sep 16, 1997
- United Microelectronics Corporation
- Hong Jen Wu
- H01 - BASIC ELECTRIC ELEMENTS