Jack Mumbo

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Beaverton, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Pogo pin integrated circuit package mount
- Patent number 9,844,144
- Issue date Dec 12, 2017
- Intel Corporation
- Emad Al-Momani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STACKED TIME-OF-FLIGHT MODULE
- Publication number 20240241231
- Publication date Jul 18, 2024
- Meta Platforms Technologies, LLC
- Jack Diepen Mumbo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID COOLED COLD PLATE FOR MULTIPLE SEMICONDUCTOR CHIP PACKAGES
- Publication number 20220173015
- Publication date Jun 2, 2022
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H01 - BASIC ELECTRIC ELEMENTS