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Jack S. Conrad

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  • Harrisburg, PA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    High density interconnect system
    • Patent number 4,582,374
    • Issue date Apr 15, 1986
    • AMP Incorporated
    • Jack S. Conrad
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Modular plug board system
    • Patent number 4,134,631
    • Issue date Jan 16, 1979
    • AMP Incorporated
    • Jack S. Conrad
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR