Jacky CHANG

Follow

Person

Zhubei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Cu pillar bump with electrolytic metal sidewall protection
- Patent number 9,006,097
- Issue date Apr 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu pillar bump with electrolytic metal sidewall protection
- Patent number 8,492,891
- Issue date Jul 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION
- Publication number 20130295762
- Publication date Nov 7, 2013
- Wen-Hsiung LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PILLAR BUMP WITH ELECTROLYTIC METAL SIDEWALL PROTECTION
- Publication number 20110260317
- Publication date Oct 27, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung LU
- H01 - BASIC ELECTRIC ELEMENTS