Jacob Crane

Person

Woodbridge, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal performance package for integrated circuit chip
- Patent number 5,939,214
- Issue date Aug 17, 1999
- Advanced Technology Interconnect, Incorporated
- Deepak Mahulikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesively sealed metal electronic package incorporating a multi-ch...
- Patent number 5,504,372
- Issue date Apr 2, 1996
- Olin Corporation
- Jeffrey S. Braden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Machinable copper alloys having reduced lead content
- Patent number 5,409,552
- Issue date Apr 25, 1995
- Olin Corporation
- David D. McDevitt
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Electronic package with stress relief channel
- Patent number 5,315,155
- Issue date May 24, 1994
- Olin Corporation
- Brian E. O'Donnelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Machinable copper alloys having reduced lead content
- Patent number 5,288,458
- Issue date Feb 22, 1994
- Olin Corporation
- David D. McDevitt
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Palladium alloys having utility in electrical applications
- Patent number 5,236,789
- Issue date Aug 17, 1993
- Olin Corporation
- John G. Cowie
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Palladium alloys having utility in electrical applications
- Patent number 5,139,891
- Issue date Aug 18, 1992
- Olin Corporation
- John G. Cowie
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Machinable copper alloys having reduced lead content
- Patent number 5,137,685
- Issue date Aug 11, 1992
- Olin Corporation
- David D. McDevitt
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Process for improving the electrical conductivity of a copper-nicke...
- Patent number 5,017,244
- Issue date May 21, 1991
- Olin Corporation
- Ashok Sankaranarayanan
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Thermal performance package for integrated circuit chip
- Patent number 5,015,803
- Issue date May 14, 1991
- Olin Corporation
- Deepak Mahulikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Kit for the assembly of a metal electronic package
- Patent number 5,013,871
- Issue date May 7, 1991
- Olin Corporation
- Deepak Mahulikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal electronic package
- Patent number 4,897,508
- Issue date Jan 30, 1990
- Olin Corporation
- Deepak Mahulikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 4,888,449
- Issue date Dec 19, 1989
- Olin Corporation
- Jacob Crane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-iron-nickel composite material for electrical and electronic...
- Patent number 4,822,693
- Issue date Apr 18, 1989
- Olin Corporation
- Sankaranarayanan Ashok
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Special surfaces for wire bonding
- Patent number 4,767,049
- Issue date Aug 30, 1988
- Olin Corporation
- Sheldon H. Butt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Acicular magnetic particles
- Patent number 4,728,363
- Issue date Mar 1, 1988
- Olin Corporation
- Jacob Crane
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Techniques for preparing magnetic particles having utility in recor...
- Patent number 4,698,140
- Issue date Oct 6, 1987
- Olin Corporation
- Jacob Crane
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of producing ferromagnetic particles
- Patent number 4,657,583
- Issue date Apr 14, 1987
- Olin Corporation
- Jacob Crane
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Precipitation hardenable copper alloy and process
- Patent number 4,434,016
- Issue date Feb 28, 1984
- Olin Corporation
- Yousef Saleh
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
High conductivity high temperature copper alloy
- Patent number 4,202,688
- Issue date May 13, 1980
- Olin Corporation
- Jacob Crane
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper base alloys
- Patent number 4,071,359
- Issue date Jan 31, 1978
- Olin Corporation
- Harvey P. Cheskis
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
High conductivity high temperature copper alloy
- Patent number 3,976,477
- Issue date Aug 24, 1976
- Olin Corporation
- Jacob Crane
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper base alloy
- Patent number 3,953,249
- Issue date Apr 27, 1976
- Olin Corporation
- Michael J. Pryor
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Process for improving the elongation of grain refined copper base a...
- Patent number 3,941,619
- Issue date Mar 2, 1976
- Olin Corporation
- Eugene Shapiro
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method of processing copper base alloys
- Patent number 3,941,620
- Issue date Mar 2, 1976
- Olin Corporation
- Michael J. Pryor
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Process for preparing copper base alloys
- Patent number 3,940,290
- Issue date Feb 24, 1976
- Olin Corporation
- Michael J. Pryor
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Jacob Crane

Person

Patents Grantslast 30 patents

Thermal performance package for integrated circuit chip

Adhesively sealed metal electronic package incorporating a multi-ch...

Machinable copper alloys having reduced lead content

Electronic package with stress relief channel

Machinable copper alloys having reduced lead content

Palladium alloys having utility in electrical applications

Palladium alloys having utility in electrical applications

Machinable copper alloys having reduced lead content

Process for improving the electrical conductivity of a copper-nicke...

Thermal performance package for integrated circuit chip

Kit for the assembly of a metal electronic package

Metal electronic package

Semiconductor package

Copper-iron-nickel composite material for electrical and electronic...

Special surfaces for wire bonding

Acicular magnetic particles

Techniques for preparing magnetic particles having utility in recor...

Method of producing ferromagnetic particles

Precipitation hardenable copper alloy and process

High conductivity high temperature copper alloy

Copper base alloys

High conductivity high temperature copper alloy

Copper base alloy

Process for improving the elongation of grain refined copper base a...

Method of processing copper base alloys

Process for preparing copper base alloys