Jacob E. Wylie

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for wafer electroless plating
- Patent number 9,287,110
- Issue date Mar 15, 2016
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fluid handling system for wafer electroless plating and associated...
- Patent number 8,844,461
- Issue date Sep 30, 2014
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for wafer electroless plating
- Patent number 8,485,120
- Issue date Jul 16, 2013
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer electroless plating system and associated methods
- Patent number 8,314,027
- Issue date Nov 20, 2012
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Proximity processing using controlled batch volume with an integrat...
- Patent number 8,221,608
- Issue date Jul 17, 2012
- Lam Research Corporation
- Carl A. Woods
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for gate valve movement in a minimum-space wet process en...
- Patent number 8,083,207
- Issue date Dec 27, 2011
- Lam Research Corporation
- Jacob Wylie
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Wafer electroless plating system and associated methods
- Patent number 8,069,813
- Issue date Dec 6, 2011
- Lam Research Corporation
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Proximity processing using controlled batch volume with an integrat...
- Patent number 7,811,423
- Issue date Oct 12, 2010
- Lam Research Corporation
- Carl A. Woods
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Method and Apparatus for Wafer Electroless Plating
- Publication number 20130280917
- Publication date Oct 24, 2013
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wafer Electroless Plating System and Associated Methods
- Publication number 20120045897
- Publication date Feb 23, 2012
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROXIMITY PROCESSING USING CONTROLLED BATCH VOLUME WITH AN INTEGRAT...
- Publication number 20110017605
- Publication date Jan 27, 2011
- Carl A. Woods
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INSTANT HOT WATER DELIVERY SYSTEM
- Publication number 20100096018
- Publication date Apr 22, 2010
- Jacob E. Wylie
- F24 - HEATING RANGES VENTILATING
Information Patent Application
Instant Hot Water Delivery System
- Publication number 20090211644
- Publication date Aug 27, 2009
- Jacob E. Wylie
- F24 - HEATING RANGES VENTILATING
Information Patent Application
PROXIMITY PROCESSING USING CONTROLLED BATCH VOLUME WITH AN INTEGRAT...
- Publication number 20080296166
- Publication date Dec 4, 2008
- Lam Research Corporation
- Carl A. Woods
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Fluid Handling System for Wafer Electroless Plating and Associated...
- Publication number 20080251148
- Publication date Oct 16, 2008
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wafer Electroless Plating System and Associated Methods
- Publication number 20080254621
- Publication date Oct 16, 2008
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and Apparatus for Wafer Electroless Plating
- Publication number 20080254225
- Publication date Oct 16, 2008
- LAM RESEARCH CORPORATION
- William Thie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Jacob E. Wylie

Person

Patents Grantslast 30 patents

Method and apparatus for wafer electroless plating

Fluid handling system for wafer electroless plating and associated...

Method and apparatus for wafer electroless plating

Wafer electroless plating system and associated methods

Proximity processing using controlled batch volume with an integrat...

Apparatus for gate valve movement in a minimum-space wet process en...

Wafer electroless plating system and associated methods

Proximity processing using controlled batch volume with an integrat...

Patents Applicationslast 30 patents

Method and Apparatus for Wafer Electroless Plating

Wafer Electroless Plating System and Associated Methods

PROXIMITY PROCESSING USING CONTROLLED BATCH VOLUME WITH AN INTEGRAT...

INSTANT HOT WATER DELIVERY SYSTEM

Instant Hot Water Delivery System

PROXIMITY PROCESSING USING CONTROLLED BATCH VOLUME WITH AN INTEGRAT...

Fluid Handling System for Wafer Electroless Plating and Associated...

Wafer Electroless Plating System and Associated Methods

Method and Apparatus for Wafer Electroless Plating