Jacob Jeng

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package architecture with a variable dispensed c...
- Patent number 6,200,828
- Issue date Mar 13, 2001
- AMIC Technology, Inc.
- Jacob Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture for dual-chip integrated circuit package and method of...
- Patent number 6,133,067
- Issue date Oct 17, 2000
- Amic Technology Inc.
- Jacob Jeng
- H01 - BASIC ELECTRIC ELEMENTS