Jacob L. Williams

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Gilbert, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Thin film resistor (TFR) formed in an integrated circuit device usi...
- Patent number 11,508,500
- Issue date Nov 22, 2022
- Microchip Technology Incorporated
- Paul Fest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film resistor (TFR) formed in an integrated circuit device usi...
- Patent number 11,495,657
- Issue date Nov 8, 2022
- Microchip Technology Incorporated
- Paul Fest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOS transistor with improved metal contact
- Patent number 8,937,351
- Issue date Jan 20, 2015
- Microchip Technology Incorporated
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submicron contact fill using a CVD TiN barrier and high temperature...
- Patent number 7,226,858
- Issue date Jun 5, 2007
- Microchip Technology Incorporated
- Jacob Lee Williams
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THIN FILM RESISTOR (TFR) FORMED IN AN INTEGRATED CIRCUIT DEVICE USI...
- Publication number 20210273037
- Publication date Sep 2, 2021
- MICROCHIP TECHNOLOGY INCORPORATED
- Paul Fest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM RESISTOR (TFR) FORMED IN AN INTEGRATED CIRCUIT DEVICE USI...
- Publication number 20210272725
- Publication date Sep 2, 2021
- MICROCHIP TECHNOLOGY INCORPORATED
- Paul Fest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power MOS Transistor with Improved Metal Contact
- Publication number 20140246722
- Publication date Sep 4, 2014
- MICROCHIP TECHNOLOGY INCORPORATED
- Gregory Dix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCRUBBER CLEAN BEFORE OXIDE CHEMICAL MECHANICAL POLISH (CMP) FOR RE...
- Publication number 20100258143
- Publication date Oct 14, 2010
- MICROCHIP TECHNOLOGY INCORPORATED
- Jacob L. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Submicron contact fill using a CVD TiN barrier and high temperature...
- Publication number 20060076680
- Publication date Apr 13, 2006
- MICROCHIP TECHNOLOGY INCORPORATED
- Jacob Lee Williams
- H01 - BASIC ELECTRIC ELEMENTS