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Moirans, FR
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last 30 patents
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Patent Grant
Dual side package on package
Patent number
9,006,904
Issue date
Apr 14, 2015
STMicroelectronics (Grenoble 2) SAS
Dominique Marais
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electrical connection board and assembly of such a board and a semi...
Patent number
8,013,253
Issue date
Sep 6, 2011
STMicroelectronics S.A.
Pierre Bormann
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Device for electrical connection of an integrated circuit chip
Patent number
7,888,791
Issue date
Feb 15, 2011
STMicroelectronics S.A.
Pierre Bormann
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Device for electrical connection of an integrated circuit chip
Patent number
7,589,411
Issue date
Sep 15, 2009
STMicroelectronics S.A.
Pierre Bormann
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
DUAL SIDE PACKAGE ON PACKAGE
Publication number
20130214425
Publication date
Aug 22, 2013
STMicroelectronics (Grenoble 2) SAS
Dominique Marais
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE FOR ELECTRICAL CONNECTION OF AN INTEGRATED CIRCUIT CHIP
Publication number
20090310319
Publication date
Dec 17, 2009
STMicroelectronics S.A.
Pierre Bormann
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRICAL CONNECTION BOARD AND ASSEMBLY OF SUCH A BOARD AND A SEMI...
Publication number
20080261415
Publication date
Oct 23, 2008
STMicroelectronics S.A.
Pierre Bormann
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Device for electrical connection of an integrated circuit chip
Publication number
20060138636
Publication date
Jun 29, 2006
STMicroelectronics S.A.
Pierre Bormann
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR