Jadhav G. Susheel

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Silicon photonic integrated lens compatible with wafer processing
- Patent number 11,894,474
- Issue date Feb 6, 2024
- Intel Corporation
- Priyanka Dobriyal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling layer to reduce underfill stress in semiconductor devices
- Patent number 11,715,928
- Issue date Aug 1, 2023
- Intel Corporation
- Priyanka Dobriyal
- G02 - OPTICS
Information Patent Grant
Solder deposition and thermal processing of thin-die thermal interf...
- Patent number 8,733,620
- Issue date May 27, 2014
- Intel Corporation
- Mukul Renavikar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coated thermal interface in integrated circuit die
- Patent number 7,955,900
- Issue date Jun 7, 2011
- Intel Corporation
- Susheel G. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating a heat spreader with an interface material having reduc...
- Patent number 7,553,702
- Issue date Jun 30, 2009
- Intel Corporation
- Thomas J Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods including fluxless chip attach processes
- Patent number 7,534,715
- Issue date May 19, 2009
- Intel Corporation
- Susheel Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader with intermetallic layer and method for ma...
- Patent number 7,485,495
- Issue date Feb 3, 2009
- Intel Corporation
- Mukul P. Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for attaching a semiconductor die to a heat sp...
- Patent number 7,407,085
- Issue date Aug 5, 2008
- Intel Corporation
- Jadhav G. Susheel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated heat spreader and method for using
- Patent number 7,239,517
- Issue date Jul 3, 2007
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for attaching a semiconductor die to a substrate and heat sp...
- Patent number 7,220,622
- Issue date May 22, 2007
- Intel Corporation
- Susheel G. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader with intermetallic layer and method for ma...
- Patent number 7,183,641
- Issue date Feb 27, 2007
- Intel Corporation
- Mukul P. Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface apparatus, systems, and methods
- Patent number 7,164,585
- Issue date Jan 16, 2007
- Intel Corporation
- Susheel G. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES
- Publication number 20220155539
- Publication date May 19, 2022
- Intel Corporation
- Srinivas V. PIETAMBARAM
- G02 - OPTICS
Information Patent Application
INTEGRATED PHOTONICS AND PROCESSOR PACKAGE WITH REDISTRIBUTION LAYE...
- Publication number 20210407909
- Publication date Dec 30, 2021
- Intel Corporation
- Susheel JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS
- Publication number 20210210478
- Publication date Jul 8, 2021
- Intel Corporation
- Susheel JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PHOTONIC INTEGRATED LENS COMPATIBLE WITH WAFER PROCESSING
- Publication number 20210074866
- Publication date Mar 11, 2021
- Intel Corporation
- Priyanka DOBRIYAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING LAYER TO REDUCE UNDERFILL STRESS IN SEMICONDUCTOR DEVICES
- Publication number 20210066882
- Publication date Mar 4, 2021
- Intel Corporation
- Priyanka Dobriyal
- G02 - OPTICS
Information Patent Application
HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH
- Publication number 20160260679
- Publication date Sep 8, 2016
- Intel Corporation
- Kabirkumar J. Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED THERMAL INTERFACE IN INTEGRATED CIRCUIT DIE
- Publication number 20070231967
- Publication date Oct 4, 2007
- Susheel G. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HEAT SPREADER AND METHOD FOR USING
- Publication number 20070206356
- Publication date Sep 6, 2007
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluxless chip attached processes and devices
- Publication number 20070152328
- Publication date Jul 5, 2007
- Susheel Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder deposition and thermal processing of thin-die thermal interf...
- Publication number 20070131737
- Publication date Jun 14, 2007
- Intel Corporation
- Mukul Renavikar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED HEAT SPREADER WITH INTERMETALLIC LAYER AND METHOD FOR MA...
- Publication number 20070117270
- Publication date May 24, 2007
- Mukul P. Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated heat spreader and method for using
- Publication number 20060227510
- Publication date Oct 12, 2006
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated heat spreader with intermetallic layer and method for ma...
- Publication number 20060220226
- Publication date Oct 5, 2006
- Intel Corporation
- Mukul P. Renavikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for attaching a semiconductor die to a substrate and heat sp...
- Publication number 20060063310
- Publication date Mar 23, 2006
- Susheel G. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for attaching a semiconductor die to a heat sp...
- Publication number 20060060637
- Publication date Mar 23, 2006
- Jadhav G. Susheel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal interface apparatus, systems, and methods
- Publication number 20040190263
- Publication date Sep 30, 2004
- Intel Corporation
- Susheel G. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS

Jadhav G. Susheel

Person

Patents Grantslast 30 patents

Silicon photonic integrated lens compatible with wafer processing

Decoupling layer to reduce underfill stress in semiconductor devices

Solder deposition and thermal processing of thin-die thermal interf...

Coated thermal interface in integrated circuit die

Integrating a heat spreader with an interface material having reduc...

Methods including fluxless chip attach processes

Integrated heat spreader with intermetallic layer and method for ma...

Apparatus and method for attaching a semiconductor die to a heat sp...

Integrated heat spreader and method for using

Method for attaching a semiconductor die to a substrate and heat sp...

Integrated heat spreader with intermetallic layer and method for ma...

Thermal interface apparatus, systems, and methods

Patents Applicationslast 30 patents

HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES

INTEGRATED PHOTONICS AND PROCESSOR PACKAGE WITH REDISTRIBUTION LAYE...

PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS

SILICON PHOTONIC INTEGRATED LENS COMPATIBLE WITH WAFER PROCESSING

DECOUPLING LAYER TO REDUCE UNDERFILL STRESS IN SEMICONDUCTOR DEVICES

HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH

COATED THERMAL INTERFACE IN INTEGRATED CIRCUIT DIE

INTEGRATED HEAT SPREADER AND METHOD FOR USING

Fluxless chip attached processes and devices

Solder deposition and thermal processing of thin-die thermal interf...

INTEGRATED HEAT SPREADER WITH INTERMETALLIC LAYER AND METHOD FOR MA...

Integrated heat spreader and method for using

Integrated heat spreader with intermetallic layer and method for ma...

Method for attaching a semiconductor die to a substrate and heat sp...

Apparatus and method for attaching a semiconductor die to a heat sp...

Thermal interface apparatus, systems, and methods