Jae-cheon Doh

Person

Cheonan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Electric component module and method of manufacturing the same
- Patent number 9,510,461
- Issue date Nov 29, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Il Hyeong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 9,048,199
- Issue date Jun 2, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Do-Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D power module package
- Patent number 8,842,438
- Issue date Sep 23, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and manufacturing method thereof
- Patent number 8,779,580
- Issue date Jul 15, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Joon-Seok Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, solid-state imaging apparatus using the same, and...
- Patent number 8,054,370
- Issue date Nov 8, 2011
- Samsung Electronics Co., Ltd.
- Min-Kyo Cho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wafer level package fabrication method
- Patent number 7,696,004
- Issue date Apr 13, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Jingli Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package film having reinforcing member and related di...
- Patent number 7,683,476
- Issue date Mar 23, 2010
- Samsung Electronics Co., Ltd.
- Si-hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package
- Patent number 7,670,878
- Issue date Mar 2, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Jing Li Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, solid-state imaging apparatus using the same, and...
- Patent number 7,659,936
- Issue date Feb 9, 2010
- Samsung Electronics Co., Ltd.
- Min-Kyo Cho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor camera module and method of fabricating the same
- Patent number 7,484,901
- Issue date Feb 3, 2009
- Samsung Electronics Co., Ltd.
- Byoung-Rim Seo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150062854
- Publication date Mar 5, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Seung Yong CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140376193
- Publication date Dec 25, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Il Hyeong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE
- Publication number 20140313676
- Publication date Oct 23, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Joon-Seok KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20130045574
- Publication date Feb 21, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do-Jae YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE PACKAGE MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20130026616
- Publication date Jan 31, 2013
- Samsung Electro-Mechanics CO., LTD.
- Suk Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D POWER MODULE PACKAGE
- Publication number 20120162931
- Publication date Jun 28, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20110298103
- Publication date Dec 8, 2011
- Samsung Electro-Mechanics CO., LTD.
- Do-Jae YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, SOLID-STATE IMAGING APPARATUS USING THE SAME, AND...
- Publication number 20100102445
- Publication date Apr 29, 2010
- Min-Kyo Cho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Wafer level package fabrication method
- Publication number 20080299706
- Publication date Dec 4, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Jingli Yuan
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Camera module package
- Publication number 20080296577
- Publication date Dec 4, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Jingli Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level package of image sensor and method for manufacturing th...
- Publication number 20080296714
- Publication date Dec 4, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Jingli Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor package
- Publication number 20080286904
- Publication date Nov 20, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Jing Li Yuan
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Electronic component package and manufacturing method thereof
- Publication number 20080212288
- Publication date Sep 4, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Joon-Seok Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic package and manufacturing method thereof
- Publication number 20080211083
- Publication date Sep 4, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Joon-Seok Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tape substrate having reinforcement layer for tape packages
- Publication number 20080063789
- Publication date Mar 13, 2008
- Ye-Chung Chung
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor package film having reinforcing member and related di...
- Publication number 20070057360
- Publication date Mar 15, 2007
- Si-hoon Lee
- G02 - OPTICS
Information Patent Application
Tape substrate having reinforcement layer for tape packages
- Publication number 20070042166
- Publication date Feb 22, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Ye-Chung Chung
- B32 - LAYERED PRODUCTS
Information Patent Application
Image sensor camera module and method of fabricating the same
- Publication number 20060028573
- Publication date Feb 9, 2006
- Byoung-Rim Seo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Chip package, image sensor module including chip package, and manuf...
- Publication number 20050258502
- Publication date Nov 24, 2005
- Yung-Cheol Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring substrate, solid-state imaging apparatus using the same, and...
- Publication number 20050174469
- Publication date Aug 11, 2005
- Min-Kyo Cho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Dual die package and manufacturing method thereof
- Publication number 20020113304
- Publication date Aug 22, 2002
- Samsung Electronics Co., Ltd.
- Jae-Cheon Doh
- H01 - BASIC ELECTRIC ELEMENTS

Jae-cheon Doh

Person

Patents Grantslast 30 patents

Electric component module and method of manufacturing the same

Semiconductor package and method of manufacturing the semiconductor...

3D power module package

Electronic component package and manufacturing method thereof

Wiring substrate, solid-state imaging apparatus using the same, and...

Wafer level package fabrication method

Semiconductor package film having reinforcing member and related di...

Method for manufacturing semiconductor package

Wiring substrate, solid-state imaging apparatus using the same, and...

Image sensor camera module and method of fabricating the same

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME

ELECTRIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

POWER DEVICE PACKAGE MODULE AND MANUFACTURING METHOD THEREOF

3D POWER MODULE PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

WIRING SUBSTRATE, SOLID-STATE IMAGING APPARATUS USING THE SAME, AND...

Wafer level package fabrication method

Camera module package

Wafer level package of image sensor and method for manufacturing th...

Method for manufacturing semiconductor package

Electronic component package and manufacturing method thereof

Electronic package and manufacturing method thereof

Tape substrate having reinforcement layer for tape packages

Semiconductor package film having reinforcing member and related di...

Tape substrate having reinforcement layer for tape packages

Image sensor camera module and method of fabricating the same

Chip package, image sensor module including chip package, and manuf...

Wiring substrate, solid-state imaging apparatus using the same, and...

Dual die package and manufacturing method thereof