Jae Hak Yee

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package-in-package system housing a plurality of...
- Patent number 8,946,878
- Issue date Feb 3, 2015
- Stats Chippac Ltd.
- Chee Keong Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with leads having multiple sides...
- Patent number 8,847,413
- Issue date Sep 30, 2014
- Stats Chippac Ltd.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with stacked die
- Patent number 8,810,019
- Issue date Aug 19, 2014
- Stats Chippac Ltd.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with leadframe and method of ma...
- Patent number 8,581,382
- Issue date Nov 12, 2013
- Stats Chippac Ltd.
- Guo Qiang Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacture of inline integrated circuit system
- Patent number 8,501,540
- Issue date Aug 6, 2013
- Stats Chippac Ltd.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with package-on-package and met...
- Patent number 8,207,015
- Issue date Jun 26, 2012
- Stats Chippac Ltd.
- Guo Qiang Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package system with stacked die
- Patent number 8,138,591
- Issue date Mar 20, 2012
- Stats Chippac Ltd.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system for package stacking and manufact...
- Patent number 8,067,272
- Issue date Nov 29, 2011
- Stats Chippac Ltd.
- Young Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with stacked devices
- Patent number 8,018,039
- Issue date Sep 13, 2011
- Stats Chippac Ltd.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inline integrated circuit system
- Patent number 7,968,981
- Issue date Jun 28, 2011
- Stats Chippac Ltd.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable multi-chip package system with support structure
- Patent number 7,915,738
- Issue date Mar 29, 2011
- Stats Chippac Ltd.
- Young Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKED DIE
- Publication number 20120133038
- Publication date May 31, 2012
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADFRAME AND METHOD OF MA...
- Publication number 20110309530
- Publication date Dec 22, 2011
- Guo Qiang Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND MET...
- Publication number 20110266664
- Publication date Nov 3, 2011
- Guo Qiang Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM WITH LEAD OVERLAP AND ME...
- Publication number 20110248391
- Publication date Oct 13, 2011
- Wei Qiang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURE OF INLINE INTEGRATED CIRCUIT SYSTEM
- Publication number 20110244635
- Publication date Oct 6, 2011
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MULTI-CHIP PACKAGE SYSTEM WITH SUPPORT STRUCTURE
- Publication number 20100052117
- Publication date Mar 4, 2010
- Young Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING AND MANUFACT...
- Publication number 20100038768
- Publication date Feb 18, 2010
- Young Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INLINE INTEGRATED CIRCUIT SYSTEM
- Publication number 20090258494
- Publication date Oct 15, 2009
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKED DEVICES
- Publication number 20090224389
- Publication date Sep 10, 2009
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
- Publication number 20090146271
- Publication date Jun 11, 2009
- Chee Keong Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADS HAVING MULTIPLE SIDES...
- Publication number 20080171405
- Publication date Jul 17, 2008
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKED DIE
- Publication number 20080073770
- Publication date Mar 27, 2008
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS

Jae Hak Yee

Person

Patents Grantslast 30 patents

Integrated circuit package-in-package system housing a plurality of...

Integrated circuit package system with leads having multiple sides...

Integrated circuit package system with stacked die

Integrated circuit packaging system with leadframe and method of ma...

Method for manufacture of inline integrated circuit system

Integrated circuit packaging system with package-on-package and met...

Integrated circuit package system with stacked die

Integrated circuit package system for package stacking and manufact...

Integrated circuit package system with stacked devices

Inline integrated circuit system

Stackable multi-chip package system with support structure

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKED DIE

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADFRAME AND METHOD OF MA...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND MET...

INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM WITH LEAD OVERLAP AND ME...

METHOD FOR MANUFACTURE OF INLINE INTEGRATED CIRCUIT SYSTEM

STACKABLE MULTI-CHIP PACKAGE SYSTEM WITH SUPPORT STRUCTURE

INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING AND MANUFACT...

INLINE INTEGRATED CIRCUIT SYSTEM

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKED DEVICES

INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADS HAVING MULTIPLE SIDES...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKED DIE