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Jae Heun Joung
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Cheongju-si, KR
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last 30 patents
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Patent Grant
Method for manufacturing build-up multi-layer printed circuit board...
Patent number
6,405,431
Issue date
Jun 18, 2002
Samsung Electro-Mechanics Co., Ltd.
Dong Shin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Grant
Method for manufacturing multi-layer printed circuit board
Patent number
6,119,335
Issue date
Sep 19, 2000
Samsung Electro-Mechanics Co., Ltd.
Keon Yang Park
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR