Jae Hun Ku

Person

Singapore, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Leadframe and semiconductor package made using the leadframe
- Patent number 9,362,210
- Issue date Jun 7, 2016
- Amkor Technology, Inc.
- Byung Hoon Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of making using leadframe having l...
- Patent number 7,564,122
- Issue date Jul 21, 2009
- Amkor Technology, Inc.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe having lead locks to secure leads to encapsulant
- Patent number 7,057,280
- Issue date Jun 6, 2006
- Amkor Technology, Inc.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 6,858,919
- Issue date Feb 22, 2005
- Amkor Technology, Inc.
- Seong Min Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of making using leadframe having l...
- Patent number 6,825,062
- Issue date Nov 30, 2004
- Amkor Technology, Inc.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
End grid array semiconductor package
- Patent number 6,677,663
- Issue date Jan 13, 2004
- Amkor Technology, Inc.
- Jae Hun Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin and heat radiant semiconductor package and method for manufact...
- Patent number 6,646,339
- Issue date Nov 11, 2003
- Amkor Technology, Inc.
- Jae Hun Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing semiconductor packages
- Patent number 6,616,436
- Issue date Sep 9, 2003
- Amkor Technology, Inc.
- Hyung Ju Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor package and method of making using leadframe having l...
- Patent number 6,448,633
- Issue date Sep 10, 2002
- Amkor Technology, Inc.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEADFRAME AND SEMICONDUCTOR PACKAGE MADE USING THE LEADFRAME
- Publication number 20130181335
- Publication date Jul 18, 2013
- Amkor Technology, Inc.
- Byung Hoon Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method of making using leadframe having l...
- Publication number 20080036055
- Publication date Feb 14, 2008
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20050062148
- Publication date Mar 24, 2005
- Seong Min Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe and semiconductor package made using the leadframe
- Publication number 20050029638
- Publication date Feb 10, 2005
- Byung Hoon Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method of making leadframe having lead lo...
- Publication number 20040097016
- Publication date May 20, 2004
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin and heat radiant semiconductor package and method for manufact...
- Publication number 20040061217
- Publication date Apr 1, 2004
- Jae Hun Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method of making using leadframe having l...
- Publication number 20030020146
- Publication date Jan 30, 2003
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package including stacked chips
- Publication number 20030001252
- Publication date Jan 2, 2003
- Jae Hun Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20020020907
- Publication date Feb 21, 2002
- Amkor Technology, Inc.
- Seong Min Seo
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Leadframe and semiconductor package made using the leadframe

Semiconductor package and method of making using leadframe having l...

Leadframe having lead locks to secure leads to encapsulant

Semiconductor package

Semiconductor package and method of making using leadframe having l...

End grid array semiconductor package

Thin and heat radiant semiconductor package and method for manufact...

Apparatus for manufacturing semiconductor packages

Semiconductor package and method of making using leadframe having l...

Patents Applicationslast 30 patents

LEADFRAME AND SEMICONDUCTOR PACKAGE MADE USING THE LEADFRAME

Semiconductor package and method of making using leadframe having l...

Semiconductor package

Leadframe and semiconductor package made using the leadframe

Semiconductor package and method of making leadframe having lead lo...

Thin and heat radiant semiconductor package and method for manufact...

Semiconductor package and method of making using leadframe having l...

Semiconductor package including stacked chips

Semiconductor package