Jae-hyun Phee

Person

Gyeyang-gu, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming a semiconductor package using a seed layer and s...
- Patent number 8,778,776
- Issue date Jul 15, 2014
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip having via electrodes and stacked semiconductor...
- Patent number 8,637,989
- Issue date Jan 28, 2014
- Samsung Electronics Co., Ltd.
- Ho-jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, method of manufacturing the same, and meth...
- Patent number 8,586,477
- Issue date Nov 19, 2013
- Samsung Electronics Co., Ltd.
- Se-young Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having electrodes
- Patent number 8,575,760
- Issue date Nov 5, 2013
- Samsung Electronics Co., Ltd.
- Jae-hyun Phee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through silicon via (TSV)
- Patent number 8,564,102
- Issue date Oct 22, 2013
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer TSV insulation and methods of fabricating the same
- Patent number 8,492,902
- Issue date Jul 23, 2013
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING AN INTERPOSER AND A METHOD OF MANUFACTURING A SEM...
- Publication number 20180108540
- Publication date Apr 19, 2018
- Samsung Electronics Co., Ltd.
- Jae-Hyun Phee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140145327
- Publication date May 29, 2014
- Samsung Electronics Co., Ltd.
- Hyung-Jun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING VIA ELECTRODES AND STACKED SEMICONDUCTOR...
- Publication number 20120299194
- Publication date Nov 29, 2012
- Ho-jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR ELECTROPLATING FOR SEMICONDUCTOR SUBSTRATE
- Publication number 20120292195
- Publication date Nov 22, 2012
- Ui Hyoung LEE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SEMICONDUCTOR DE...
- Publication number 20120199981
- Publication date Aug 9, 2012
- Se-young Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Having Electrodes and Methods of Fabricating...
- Publication number 20120133041
- Publication date May 31, 2012
- Jae-hyun Phee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming a Semiconductor Package Using a Seed Layer and...
- Publication number 20120083097
- Publication date Apr 5, 2012
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER TSV INSULATION AND METHODS OF FABRICATING THE SAME
- Publication number 20120074584
- Publication date Mar 29, 2012
- SAMSUNG ELECTRONICS CO., LTD.
- Ho-Jin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING THE SAME, AND METH...
- Publication number 20120028412
- Publication date Feb 2, 2012
- Se-young Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20110284936
- Publication date Nov 24, 2011
- Samsung Electronics Co., Ltd.
- Ju-il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR TREATING SUBSTRATE
- Publication number 20110226626
- Publication date Sep 22, 2011
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR CHIP HAVING VIA ELECTRODES AND STACKED SEMICONDUCTOR...
- Publication number 20100105169
- Publication date Apr 29, 2010
- Ho-jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20100013094
- Publication date Jan 21, 2010
- Samsung Electronics Co., Ltd.
- Chajea JO
- H01 - BASIC ELECTRIC ELEMENTS

Jae-hyun Phee

Person

Patents Grantslast 30 patents

Methods of forming a semiconductor package using a seed layer and s...

Semiconductor chip having via electrodes and stacked semiconductor...

Semiconductor apparatus, method of manufacturing the same, and meth...

Semiconductor devices having electrodes

Semiconductor device having through silicon via (TSV)

Multi-layer TSV insulation and methods of fabricating the same

Patents Applicationslast 30 patents

METHOD OF FORMING AN INTERPOSER AND A METHOD OF MANUFACTURING A SEM...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR CHIP HAVING VIA ELECTRODES AND STACKED SEMICONDUCTOR...

APPARATUS AND METHOD FOR ELECTROPLATING FOR SEMICONDUCTOR SUBSTRATE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SEMICONDUCTOR DE...

Semiconductor Devices Having Electrodes and Methods of Fabricating...

Methods of Forming a Semiconductor Package Using a Seed Layer and...

MULTI-LAYER TSV INSULATION AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING THE SAME, AND METH...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

APPARATUS AND METHOD FOR TREATING SUBSTRATE

SEMICONDUCTOR CHIP HAVING VIA ELECTRODES AND STACKED SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME