Jae In WON

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Stack package and methods of manufacturing the same
- Patent number 11,929,262
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jae-in Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package and methods of manufacturing the same
- Patent number 11,651,975
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Jae-in Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package and methods of manufacturing the same
- Patent number 10,770,311
- Issue date Sep 8, 2020
- Samsung Electronics Co., Ltd.
- Jae-in Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply circuit including voltage regulator and headphone driv...
- Patent number 8,452,025
- Issue date May 28, 2013
- Neofidelity, Inc.
- Yeongha Choi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Dimer of chimeric recombinant binding domain-functional group fusio...
- Patent number 7,834,258
- Issue date Nov 16, 2010
- Mu-Hyeon Choe
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Pyrrole compounds, polymers thereof and EL element using the same
- Patent number 6,780,950
- Issue date Aug 24, 2004
- Korea Institute of Science and Technology
- Hyun-Nam Cho
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
STACK PACKAGE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20230245902
- Publication date Aug 3, 2023
- Samsung Electronics Co., Ltd.
- Jae-in Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20200381267
- Publication date Dec 3, 2020
- Samsung Electronics Co., Ltd.
- Jae-in Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20190088505
- Publication date Mar 21, 2019
- Samsung Electronics Co., Ltd.
- Jae-in Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20130292833
- Publication date Nov 7, 2013
- Samsung Electronics Co., Ltd.
- Jae In WON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY CIRCUIT INCLUDING VOLTAGE REGULATOR AND HEADPHONE DRIV...
- Publication number 20110222702
- Publication date Sep 15, 2011
- Neofidelity, Inc.
- Yeongha CHOI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
RESOURCE ALLOCATION METHOD FOR ORTHOGONAL FREQUENCY DIVISION MULTIP...
- Publication number 20100172316
- Publication date Jul 8, 2010
- Sung-Hyun Hwang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Dimer of chimeric recombinant binding domain-functional group fusio...
- Publication number 20070009987
- Publication date Jan 11, 2007
- Mu-Hyeon Choe
- C07 - ORGANIC CHEMISTRY
Information Patent Application
Pyrrole compounds, polymers thereof and EL element using the same
- Publication number 20040034189
- Publication date Feb 19, 2004
- KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
- Hyun-Nam Cho
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Person

Patents Grantslast 30 patents

Stack package and methods of manufacturing the same

Stack package and methods of manufacturing the same

Stack package and methods of manufacturing the same

Power supply circuit including voltage regulator and headphone driv...

Dimer of chimeric recombinant binding domain-functional group fusio...

Pyrrole compounds, polymers thereof and EL element using the same

Patents Applicationslast 30 patents

STACK PACKAGE AND METHODS OF MANUFACTURING THE SAME

STACK PACKAGE AND METHODS OF MANUFACTURING THE SAME

STACK PACKAGE AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

POWER SUPPLY CIRCUIT INCLUDING VOLTAGE REGULATOR AND HEADPHONE DRIV...

RESOURCE ALLOCATION METHOD FOR ORTHOGONAL FREQUENCY DIVISION MULTIP...

Dimer of chimeric recombinant binding domain-functional group fusio...

Pyrrole compounds, polymers thereof and EL element using the same