Jae-Woong Nah

Person

Closter, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Uniform chip gaps via injection-molded solder pillars
- Patent number 12,107,065
- Issue date Oct 1, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for forming solder bumps
- Patent number 11,990,437
- Issue date May 21, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Molten solder injection head with vacuum filter and differential ga...
- Patent number 11,766,729
- Issue date Sep 26, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid under-bump metallization component
- Patent number 11,749,605
- Issue date Sep 5, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus of processor wafer bonding for wafer-scale int...
- Patent number 11,651,973
- Issue date May 16, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ultrasonic-assisted solder transfer
- Patent number 11,541,472
- Issue date Jan 3, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra-thin microbattery packaging and handling
- Patent number 11,539,088
- Issue date Dec 27, 2022
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic packaging of a micro-battery device
- Patent number 11,522,243
- Issue date Dec 6, 2022
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simplified hermetic packaging of a micro-battery
- Patent number 11,411,272
- Issue date Aug 9, 2022
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simplified hermetic packaging of a micro-battery
- Patent number 11,362,382
- Issue date Jun 14, 2022
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular, frequency-flexible, superconducting quantum processor arch...
- Patent number 11,288,587
- Issue date Mar 29, 2022
- International Business Machines Corporation
- Hanhee Paik
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Combination polyimide decal with a rigid mold
- Patent number 11,270,966
- Issue date Mar 8, 2022
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 11,222,862
- Issue date Jan 11, 2022
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 11,201,138
- Issue date Dec 14, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly of quantum computing devices
- Patent number 11,195,773
- Issue date Dec 7, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Low-profile battery construct with engineered interfaces
- Patent number 11,183,725
- Issue date Nov 23, 2021
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold-welded flip chip interconnect structure
- Patent number 11,165,010
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Permanent wafer handlers with through silicon vias for thermalizati...
- Patent number 11,158,781
- Issue date Oct 26, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Continuous solder transfer to substrates
- Patent number 11,110,534
- Issue date Sep 7, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sandwich-parallel micro-battery
- Patent number 11,043,690
- Issue date Jun 22, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetial via seal for thin film battery
- Patent number 10,964,925
- Issue date Mar 30, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid under-bump metallization component
- Patent number 10,937,735
- Issue date Mar 2, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method for forming solder bumps
- Patent number 10,879,202
- Issue date Dec 29, 2020
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature triggered switch
- Patent number 10,740,667
- Issue date Aug 11, 2020
- International Business Machines Corporation
- Li-Wen Hung
- G01 - MEASURING TESTING
Information Patent Grant
Stud bumps for post-measurement qubit frequency modification
- Patent number 10,692,831
- Issue date Jun 23, 2020
- International Business Machines Corporation
- Nicholas T. Bronn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flip chip assembly of quantum computing devices
- Patent number 10,692,795
- Issue date Jun 23, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ball grid array and land grid array assemblies fabricated using tem...
- Patent number 10,679,931
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal cored solder decal structure and process
- Patent number 10,658,267
- Issue date May 19, 2020
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-profile battery construct with engineered interfaces
- Patent number 10,581,037
- Issue date Mar 3, 2020
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 10,546,836
- Issue date Jan 28, 2020
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES
- Publication number 20240038723
- Publication date Feb 1, 2024
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC PACKAGING OF A MICRO-BATTERY DEVICE
- Publication number 20220200086
- Publication date Jun 23, 2022
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS
- Publication number 20220020715
- Publication date Jan 20, 2022
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus of Processor Wafer Bonding for Wafer-Scale Int...
- Publication number 20210351043
- Publication date Nov 11, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-Thin Microbattery Packaging and Handling
- Publication number 20210280834
- Publication date Sep 9, 2021
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC-ASSISTED SOLDER TRANSFER
- Publication number 20210229203
- Publication date Jul 29, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PERMANENT WAFER HANDLERS WITH THROUGH SILICON VIAS FOR THERMALIZATI...
- Publication number 20210159382
- Publication date May 27, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMBINATION POLYIMIDE DECAL WITH A RIGID MOLD
- Publication number 20210151402
- Publication date May 20, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID UNDER-BUMP METALLIZATION COMPONENT
- Publication number 20210118808
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD FOR FORMING SOLDER BUMPS
- Publication number 20210028138
- Publication date Jan 28, 2021
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR, FREQUENCY-FLEXIBLE, SUPERCONDUCTING QUANTUM PROCESSOR ARCH...
- Publication number 20200401924
- Publication date Dec 24, 2020
- International Business Machines Corporation
- Hanhee Paik
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONTINUOUS SOLDER TRANSFER TO SUBSTRATES
- Publication number 20200316702
- Publication date Oct 8, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HERMETIAL VIA SEAL FOR THIN FILM BATTERY
- Publication number 20200274113
- Publication date Aug 27, 2020
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLD-WELDED FLIP CHIP INTERCONNECT STRUCTURE
- Publication number 20200259064
- Publication date Aug 13, 2020
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY OF QUANTUM COMPUTING DEVICES
- Publication number 20200235027
- Publication date Jul 23, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SANDWICH-PARALLEL MICRO-BATTERY
- Publication number 20200212475
- Publication date Jul 2, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY OF QUANTUM COMPUTING DEVICES
- Publication number 20200152540
- Publication date May 14, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOW-PROFILE BATTERY CONSTRUCT WITH ENGINEERED INTERFACES
- Publication number 20200144564
- Publication date May 7, 2020
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...
- Publication number 20200126951
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Bing DANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID UNDER-BUMP METALLIZATION COMPONENT
- Publication number 20200098695
- Publication date Mar 26, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20200051948
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20190348392
- Publication date Nov 14, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE TRIGGERED SWITCH
- Publication number 20190279062
- Publication date Sep 12, 2019
- International Business Machines Corporation
- Li-Wen Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BALL GRID ARRAY AND LAND GRID ARRAY ASSEMBLIES FABRICATED USING TEM...
- Publication number 20190229045
- Publication date Jul 25, 2019
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED STAND-OFFS AND MECHANICAL STOPS FOR PRECISE THREE DIMENSI...
- Publication number 20190162902
- Publication date May 30, 2019
- International Business Machines Corporation
- Tymon Barwicz
- G02 - OPTICS
Information Patent Application
INJECTION-MOLDED SOLDER (IMS) TOOL ASSEMBLY AND METHOD OF USE THEREOF
- Publication number 20190160572
- Publication date May 30, 2019
- International Business Machines Corporation
- Claudius Feger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Molten Solder Injection Head with Vacuum Filter and Differential Ga...
- Publication number 20190091786
- Publication date Mar 28, 2019
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING
- Publication number 20180344245
- Publication date Dec 6, 2018
- International Business Machines Corporation
- John U. Knickerbocker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL THIN-FILM BATTERY DEVICE
- Publication number 20180287185
- Publication date Oct 4, 2018
- International Business Machines Corporation
- Yun Seog Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL THIN-FILM BATTERY DEVICE
- Publication number 20180287187
- Publication date Oct 4, 2018
- International Business Machines Corporation
- Yun Seog Lee
- H01 - BASIC ELECTRIC ELEMENTS

Jae-Woong Nah

Person

Patents Grantslast 30 patents

Uniform chip gaps via injection-molded solder pillars

System and method for forming solder bumps

Molten solder injection head with vacuum filter and differential ga...

Hybrid under-bump metallization component

Method and apparatus of processor wafer bonding for wafer-scale int...

Ultrasonic-assisted solder transfer

Ultra-thin microbattery packaging and handling

Hermetic packaging of a micro-battery device

Simplified hermetic packaging of a micro-battery

Simplified hermetic packaging of a micro-battery

Modular, frequency-flexible, superconducting quantum processor arch...

Combination polyimide decal with a rigid mold

High speed handling of ultra-small chips by selective laser bonding...

Wafer level integration including design/co-design, structure proce...

Flip chip assembly of quantum computing devices

Low-profile battery construct with engineered interfaces

Cold-welded flip chip interconnect structure

Permanent wafer handlers with through silicon vias for thermalizati...

Continuous solder transfer to substrates

Sandwich-parallel micro-battery

Hermetial via seal for thin film battery

Hybrid under-bump metallization component

System and method for forming solder bumps

Temperature triggered switch

Stud bumps for post-measurement qubit frequency modification

Flip chip assembly of quantum computing devices

Ball grid array and land grid array assemblies fabricated using tem...

Metal cored solder decal structure and process

Low-profile battery construct with engineered interfaces

Wafer level integration including design/co-design, structure proce...

Patents Applicationslast 30 patents

CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES

HERMETIC PACKAGING OF A MICRO-BATTERY DEVICE

UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS

Method and Apparatus of Processor Wafer Bonding for Wafer-Scale Int...

Ultra-Thin Microbattery Packaging and Handling

ULTRASONIC-ASSISTED SOLDER TRANSFER

PERMANENT WAFER HANDLERS WITH THROUGH SILICON VIAS FOR THERMALIZATI...

COMBINATION POLYIMIDE DECAL WITH A RIGID MOLD

HYBRID UNDER-BUMP METALLIZATION COMPONENT

SYSTEM AND METHOD FOR FORMING SOLDER BUMPS

MODULAR, FREQUENCY-FLEXIBLE, SUPERCONDUCTING QUANTUM PROCESSOR ARCH...

CONTINUOUS SOLDER TRANSFER TO SUBSTRATES

HERMETIAL VIA SEAL FOR THIN FILM BATTERY

COLD-WELDED FLIP CHIP INTERCONNECT STRUCTURE

FLIP CHIP ASSEMBLY OF QUANTUM COMPUTING DEVICES

SANDWICH-PARALLEL MICRO-BATTERY

FLIP CHIP ASSEMBLY OF QUANTUM COMPUTING DEVICES

LOW-PROFILE BATTERY CONSTRUCT WITH ENGINEERED INTERFACES

WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCE...

HYBRID UNDER-BUMP METALLIZATION COMPONENT

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

TEMPERATURE TRIGGERED SWITCH

BALL GRID ARRAY AND LAND GRID ARRAY ASSEMBLIES FABRICATED USING TEM...

OPTIMIZED STAND-OFFS AND MECHANICAL STOPS FOR PRECISE THREE DIMENSI...

INJECTION-MOLDED SOLDER (IMS) TOOL ASSEMBLY AND METHOD OF USE THEREOF

Molten Solder Injection Head with Vacuum Filter and Differential Ga...

VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING

THREE-DIMENSIONAL THIN-FILM BATTERY DEVICE

THREE-DIMENSIONAL THIN-FILM BATTERY DEVICE