Jae-Wung Lee

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Patents Applicationslast 30 patents

Information Patent Application
Bonding structure
- Publication number 20250006684
- Publication date Jan 2, 2025
- Teknologian Tutkimuskeskus VTT Oy
- Jae-Wung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structure
- Publication number 20240312955
- Publication date Sep 19, 2024
- Teknologian Tutkimuskeskus VTT Oy
- Jae-Wung Lee
- H01 - BASIC ELECTRIC ELEMENTS