Jaecheon Lee

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Cheongju-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package of using insulating frame
- Patent number 11,062,990
- Issue date Jul 13, 2021
- NEPES LAWEH CORPORATION
- Yongtae Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 10,957,654
- Issue date Mar 23, 2021
- NEPES CO., LTD.
- Jun-Kyu Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE OF USING INSULATING FRAME
- Publication number 20190295944
- Publication date Sep 26, 2019
- NEPES CO., LTD.
- Yongtae KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190237407
- Publication date Aug 1, 2019
- NEPES CO., LTD.
- Jun-Kyu LEE
- H01 - BASIC ELECTRIC ELEMENTS