Jaechoon Kim

Person

Incheon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit semiconductor device
- Patent number 12,237,268
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jaechoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,199,002
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit semiconductor device
- Patent number 12,009,303
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Jaechoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for controlling temperature thereof
- Patent number 8,988,115
- Issue date Mar 24, 2015
- Samsung Electronics Co., Ltd.
- Jaechoon Kim
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250096061
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240332150
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Hwanjoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...
- Publication number 20240321681
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Sunggu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321841
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Hwanjoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...
- Publication number 20240321679
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Youngjoon KOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURES
- Publication number 20240321682
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jonggyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE
- Publication number 20240290720
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Jaechoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240186290
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Taehwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A HEAT DISSIPATION MEMBER
- Publication number 20240170366
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Jonggyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240145360
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hwanjoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079366
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Jonggyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055339
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Hwanjoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240014166
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Youngdeuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND COOLING SYSTEM THEREOF
- Publication number 20230307318
- Publication date Sep 28, 2023
- Samsung Electronics Co., Ltd.
- Jonggyu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM PACKAGE
- Publication number 20230178450
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Sungeun JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND COOLING SYSTEM
- Publication number 20230124783
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- JAECHOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230092410
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING HEAT SPREADER
- Publication number 20230063886
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Sungeun Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230060513
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- KIWOOK JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE
- Publication number 20220130761
- Publication date Apr 28, 2022
- Samsung Electronics Co., Ltd.
- Jaechoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND S...
- Publication number 20220037227
- Publication date Feb 3, 2022
- Seunggeol Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR CONTROLLING TEMPERATURE THEREOF
- Publication number 20130321041
- Publication date Dec 5, 2013
- Samsung Electronics Co., Ltd.
- Jaechoon Kim
- G06 - COMPUTING CALCULATING COUNTING

Jaechoon Kim

Person

Patents Grantslast 30 patents

Integrated circuit semiconductor device

Semiconductor package and method of manufacturing the same

Integrated circuit semiconductor device

Electronic device and method for controlling temperature thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...

SEMICONDUCTOR PACKAGE

HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE...

HEAT DISSIPATION STRUCTURES

INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH A HEAT DISSIPATION MEMBER

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND COOLING SYSTEM THEREOF

FILM PACKAGE

SEMICONDUCTOR PACKAGE AND COOLING SYSTEM

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE COMPRISING HEAT SPREADER

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE

THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND S...

ELECTRONIC DEVICE AND METHOD FOR CONTROLLING TEMPERATURE THEREOF