JAEEUN LEE

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and semiconductor package including the same
- Patent number 11,996,367
- Issue date May 28, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including part of underfill on portion of a m...
- Patent number 11,791,282
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including plurality of patterns
- Patent number 11,735,522
- Issue date Aug 22, 2023
- Samsung Electronics Co., Ltd.
- Hyoseok Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package including the same
- Patent number 11,694,963
- Issue date Jul 4, 2023
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including a recessed conductive post
- Patent number 11,462,462
- Issue date Oct 4, 2022
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package including the same
- Patent number 11,239,171
- Issue date Feb 1, 2022
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGHLY VERTICALLY INTEGRATED NONVOLATILE MEMORY DEVICES AND MEMORY...
- Publication number 20240049471
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Inho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230326863
- Publication date Oct 12, 2023
- Samsung Electronics Co., Ltd.
- YEONGKWON KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20230146621
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Jaekyung YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220157731
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- YEONGKWON KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING PLURALITY OF PATTERNS
- Publication number 20220059446
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- Hyoseok WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD FOR MANUFACTUR...
- Publication number 20220013474
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Jaekyung YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20210143102
- Publication date May 13, 2021
- Samsung Electronics Co., Ltd.
- YEONGKWON KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD OF DICING THE SAME
- Publication number 20210050264
- Publication date Feb 18, 2021
- Samsung Electronics Co., Ltd.
- Donghoon WON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210028098
- Publication date Jan 28, 2021
- Samsung Electronics Co., Ltd.
- JAEKYUNG YOO
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device and semiconductor package including the same

Semiconductor package including part of underfill on portion of a m...

Semiconductor device including plurality of patterns

Semiconductor device and semiconductor package including the same

Semiconductor packages including a recessed conductive post

Semiconductor device and semiconductor package including the same

Patents Applicationslast 30 patents

HIGHLY VERTICALLY INTEGRATED NONVOLATILE MEMORY DEVICES AND MEMORY...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE INCLUDING PLURALITY OF PATTERNS

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD FOR MANUFACTUR...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR SUBSTRATE AND METHOD OF DICING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME