Jaehak Kim

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Fishkill, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods of forming dual-damascene interconnect structures using adh...
- Patent number 7,459,388
- Issue date Dec 2, 2008
- Samsung Electronics Co., Ltd.
- Jaehak Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods of Forming Dual-Damascene Interconnect Structures Using Adh...
- Publication number 20080057697
- Publication date Mar 6, 2008
- SAMSUNG ELECTRONICS CO., LTD.
- Jaehak Kim
- H01 - BASIC ELECTRIC ELEMENTS