TREA

Jaehyun PHEE

Follow

Person

  • Incheon, KR
People

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SUBSTRATE BONDING APPARATUS
    • Publication number 20240153906
    • Publication date May 9, 2024
    • Samsung Electronics Co., Ltd.
    • Byeongtak PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBSTRATE BONDING METHOD
    • Publication number 20240145416
    • Publication date May 2, 2024
    • Samsung Electronics Co., Ltd.
    • Wonyoung CHOI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER TO WAFER BONDING APPARATUS AND WAFER TO WAFER BONDING METHOD
    • Publication number 20220020624
    • Publication date Jan 20, 2022
    • Samsung Electronics Co., Ltd.
    • Jaehyun PHEE
    • H01 - BASIC ELECTRIC ELEMENTS