Jaehyun YEON

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package comprising a substrate with high density interconnects
- Patent number 12,125,742
- Issue date Oct 22, 2024
- QUALCOMM Incorporated
- Hyunchul Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-directional antenna modules employing a surface-mount antenna...
- Patent number 12,126,071
- Issue date Oct 22, 2024
- QUALCOMM Incorporated
- Jaehyun Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate with a via interconnect coupled to a...
- Patent number 11,869,833
- Issue date Jan 9, 2024
- QUALCOMM Incorporated
- Kun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with a substrate comprising pad-on-pad interconnects
- Patent number 11,823,983
- Issue date Nov 21, 2023
- QUALCOMM Incorporated
- Kun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-module L-shaped millimeter wave antenna-in-package
- Patent number 11,764,489
- Issue date Sep 19, 2023
- QUALCOMM Incorporated
- Milind Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-core broadband PCB antenna
- Patent number 11,735,804
- Issue date Aug 22, 2023
- QUALCOMM Incorporated
- Chaoqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform via pad structure having covered traces between partially c...
- Patent number 11,637,057
- Issue date Apr 25, 2023
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising interconnects embedded in a solder resist layer
- Patent number 11,551,939
- Issue date Jan 10, 2023
- QUALCOMM Incorporated
- Kun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising interconnects embedded in a solder resist layer
- Patent number 11,545,425
- Issue date Jan 3, 2023
- QUALCOMM Incorporated
- Kun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device comprising multi-directional antennas in substrates coupled...
- Patent number 11,495,873
- Issue date Nov 8, 2022
- QUALCOMM Incorporated
- Jeahyeong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with substrate comprising variable thickness solder resist...
- Patent number 11,439,008
- Issue date Sep 6, 2022
- QUALCOMM Incorporated
- Kun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device comprising multi-directional antennas coupled through a flex...
- Patent number 11,399,435
- Issue date Jul 26, 2022
- QUALCOMM Incorporated
- Jaehyun Yeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Asymmetric antenna structure
- Patent number 11,258,165
- Issue date Feb 22, 2022
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-module L-shaped millimeter wave antenna-in-package
- Patent number 11,239,573
- Issue date Feb 1, 2022
- QUALCOMM Incorporated
- Milind Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
X.5 layer substrate
- Patent number 11,183,446
- Issue date Nov 23, 2021
- QUALCOMM Incorporated
- Jaehyun Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate having a via wall configured as a sh...
- Patent number 11,139,224
- Issue date Oct 5, 2021
- QUALCOMM Incorporated
- Chaoqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-package partial via on package edge
- Patent number 11,101,220
- Issue date Aug 24, 2021
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising recessed interconnects and a surface mounted p...
- Patent number 11,075,260
- Issue date Jul 27, 2021
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced antenna module with shield layer
- Patent number 11,043,740
- Issue date Jun 22, 2021
- QUALCOMM Incorporated
- Suhyung Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID CORE SUBSTRATE WITH EMBEDDED COMPONENTS
- Publication number 20240339414
- Publication date Oct 10, 2024
- QUALCOMM Incorporated
- Jaehyun YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES EMPLOYING A PACKAGE SUBSTRATE WITH A VERTICALLY-INT...
- Publication number 20230307817
- Publication date Sep 28, 2023
- QUALCOMM Incorporated
- Suhyung Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIRECTIONAL ANTENNA MODULES EMPLOYING A SURFACE-MOUNT ANTENNA...
- Publication number 20230282959
- Publication date Sep 7, 2023
- QUALCOMM Incorporated
- Jaehyun Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED...
- Publication number 20230155273
- Publication date May 18, 2023
- QUALCOMM Incorporated
- Jeahyeong HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH HIGH DENSITY INTERCONNECTS
- Publication number 20230093681
- Publication date Mar 23, 2023
- QUALCOMM Incorporated
- Hyunchul Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH A VIA INTERCONNECT COUPLED TO A...
- Publication number 20230078231
- Publication date Mar 16, 2023
- QUALCOMM Incorporated
- Kun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE EMPLOYING INTEGRATED SLOT-SHAPED ANTENNA(S), AND...
- Publication number 20230014567
- Publication date Jan 19, 2023
- QUALCOMM Incorporated
- Jaehyun Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH A SUBSTRATE COMPRISING PAD-ON-PAD INTERCONNECTS
- Publication number 20220310488
- Publication date Sep 29, 2022
- QUALCOMM Incorporated
- Kun FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUB-MODULE L-SHAPED MILLIMETER WAVE ANTENNA-IN-PACKAGE
- Publication number 20220131281
- Publication date Apr 28, 2022
- QUALCOMM Incorporated
- Milind SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COMPRISING INTERCONNECTS EMBEDDED IN A SOLDER RESIST LAYER
- Publication number 20220115312
- Publication date Apr 14, 2022
- QUALCOMM Incorporated
- Kun FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COMPRISING INTERCONNECTS EMBEDDED IN A SOLDER RESIST LAYER
- Publication number 20220068662
- Publication date Mar 3, 2022
- QUALCOMM Incorporated
- Kun FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH SUBSTRATE COMPRISING VARIABLE THICKNESS SOLDER RESIST...
- Publication number 20220053639
- Publication date Feb 17, 2022
- QUALCOMM Incorporated
- Kun FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUB-MODULE L-SHAPED MILLIMETER WAVE ANTENNA-IN-PACKAGE
- Publication number 20210376493
- Publication date Dec 2, 2021
- QUALCOMM Incorporated
- Milind SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CORE BROADBAND PCB ANTENNA
- Publication number 20210351488
- Publication date Nov 11, 2021
- QUALCOMM Incorporated
- Chaoqi ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS COUPLED THROUGH A FLEX...
- Publication number 20210345492
- Publication date Nov 4, 2021
- QUALCOMM Incorporated
- Jaehyun YEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED...
- Publication number 20210280959
- Publication date Sep 9, 2021
- QUALCOMM Incorporated
- Jeahyeong HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE HAVING A VIA WALL CONFIGURED AS A SH...
- Publication number 20210175152
- Publication date Jun 10, 2021
- QUALCOMM Incorporated
- Chaoqi ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING DISCRETE ANTENNA DEVICE
- Publication number 20210091017
- Publication date Mar 25, 2021
- QUALCOMM Incorporated
- Jaehyun YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-PACKAGE PARTIAL VIA ON PACKAGE EDGE
- Publication number 20210066197
- Publication date Mar 4, 2021
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced Antenna Module with Flexible Portion
- Publication number 20210028539
- Publication date Jan 28, 2021
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED ANTENNA MODULE WITH SHIELD LAYER
- Publication number 20200365983
- Publication date Nov 19, 2020
- QUALCOMM Incorporated
- Suhyung HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM VIA PAD STRUCTURE
- Publication number 20200219803
- Publication date Jul 9, 2020
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC ANTENNA STRUCTURE
- Publication number 20200212545
- Publication date Jul 2, 2020
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COMPRISING RECESSED INTERCONNECTS AND A SURFACE MOUNTED P...
- Publication number 20200135839
- Publication date Apr 30, 2020
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CAVITY FORMATION WITH MULTIPLE INTERCONNECTION PADS
- Publication number 20200091062
- Publication date Mar 19, 2020
- QUALCOMM Incorporated
- Jaehyun YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP PACKAGE HAVING REDUCED CONTACT PAD SIZE
- Publication number 20190371652
- Publication date Dec 5, 2019
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPERED CORNER PACKAGE FOR EMI SHIELD
- Publication number 20190341352
- Publication date Nov 7, 2019
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS

Jaehyun YEON

Person

Patents Grantslast 30 patents

Package comprising a substrate with high density interconnects

Multi-directional antenna modules employing a surface-mount antenna...

Package comprising a substrate with a via interconnect coupled to a...

Package with a substrate comprising pad-on-pad interconnects

Sub-module L-shaped millimeter wave antenna-in-package

Multi-core broadband PCB antenna

Uniform via pad structure having covered traces between partially c...

Substrate comprising interconnects embedded in a solder resist layer

Substrate comprising interconnects embedded in a solder resist layer

Device comprising multi-directional antennas in substrates coupled...

Package with substrate comprising variable thickness solder resist...

Device comprising multi-directional antennas coupled through a flex...

Asymmetric antenna structure

Sub-module L-shaped millimeter wave antenna-in-package

X.5 layer substrate

Package comprising a substrate having a via wall configured as a sh...

Through-package partial via on package edge

Substrate comprising recessed interconnects and a surface mounted p...

Enhanced antenna module with shield layer

Patents Applicationslast 30 patents

HYBRID CORE SUBSTRATE WITH EMBEDDED COMPONENTS

ANTENNA MODULES EMPLOYING A PACKAGE SUBSTRATE WITH A VERTICALLY-INT...

MULTI-DIRECTIONAL ANTENNA MODULES EMPLOYING A SURFACE-MOUNT ANTENNA...

DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED...

PACKAGE COMPRISING A SUBSTRATE WITH HIGH DENSITY INTERCONNECTS

PACKAGE COMPRISING A SUBSTRATE WITH A VIA INTERCONNECT COUPLED TO A...

PACKAGE SUBSTRATE EMPLOYING INTEGRATED SLOT-SHAPED ANTENNA(S), AND...

PACKAGE WITH A SUBSTRATE COMPRISING PAD-ON-PAD INTERCONNECTS

SUB-MODULE L-SHAPED MILLIMETER WAVE ANTENNA-IN-PACKAGE

SUBSTRATE COMPRISING INTERCONNECTS EMBEDDED IN A SOLDER RESIST LAYER

SUBSTRATE COMPRISING INTERCONNECTS EMBEDDED IN A SOLDER RESIST LAYER

PACKAGE WITH SUBSTRATE COMPRISING VARIABLE THICKNESS SOLDER RESIST...

SUB-MODULE L-SHAPED MILLIMETER WAVE ANTENNA-IN-PACKAGE

MULTI-CORE BROADBAND PCB ANTENNA

DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS COUPLED THROUGH A FLEX...

DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED...

PACKAGE COMPRISING A SUBSTRATE HAVING A VIA WALL CONFIGURED AS A SH...

PACKAGE COMPRISING DISCRETE ANTENNA DEVICE

THROUGH-PACKAGE PARTIAL VIA ON PACKAGE EDGE

Enhanced Antenna Module with Flexible Portion

ENHANCED ANTENNA MODULE WITH SHIELD LAYER

UNIFORM VIA PAD STRUCTURE

ASYMMETRIC ANTENNA STRUCTURE

SUBSTRATE COMPRISING RECESSED INTERCONNECTS AND A SURFACE MOUNTED P...

INTEGRATED CIRCUIT CAVITY FORMATION WITH MULTIPLE INTERCONNECTION PADS

INTEGRATED CIRCUIT CHIP PACKAGE HAVING REDUCED CONTACT PAD SIZE

TAPERED CORNER PACKAGE FOR EMI SHIELD