Jaejik Baek

Person

Watervliet, NY, US

People

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING 3D-STACKED FIELD-EFFECT TRANSISTORS...
- Publication number 20240282855
- Publication date Aug 22, 2024
- Samsung Electronics Co., Ltd.
- Myunghoon JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SELF-ALIGNED BACKSIDE CONTACT STRUCT...
- Publication number 20240282670
- Publication date Aug 22, 2024
- Samsung Electronics Co., Ltd.
- Myung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-STACKED TRANSISTOR STRUCTURE WITH BARRIER LAYER BETWEEN UPPER GA...
- Publication number 20240243172
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Jaejik Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF
- Publication number 20240203882
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Jongjin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING STACKED FIELD EFFECT TRANSISTO...
- Publication number 20240136354
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- KEUMSEOK PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION...
- Publication number 20240079329
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- EUN SUNG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION...
- Publication number 20240079330
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Wonhyuk Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION...
- Publication number 20240063122
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- SEUNGCHAN YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR STACKS HAVING SPACERS, AND RELATED FABRICATION METHODS
- Publication number 20230395659
- Publication date Dec 7, 2023
- Samsung Electronics Co., Ltd.
- Keumseok Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET RECESS FOR RU SUBTRACTIVE PROCESS
- Publication number 20230361032
- Publication date Nov 9, 2023
- Samsung Electronics Co., Ltd.
- Wonhyuk HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-STACKED SEMICONDUCTOR DEVICE HAVING DIFFERENT CHANNEL LAYER INTE...
- Publication number 20230352529
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Gunho JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-STACKED SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN INNER SPACER...
- Publication number 20230343823
- Publication date Oct 26, 2023
- Samsung Electronics Co., Ltd.
- Jaejik BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-STACKED SEMICONDUCTOR DEVICE INCLUDING GATE STRUCTURE FORMED OF...
- Publication number 20230343824
- Publication date Oct 26, 2023
- Samsung Electronics Co., Ltd.
- Seungchan YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-STACKED SEMICONDUCTOR DEVICE INCLUDING GATE STRUCTURE WITH RMG I...
- Publication number 20230343845
- Publication date Oct 26, 2023
- Samsung Electronics Co., Ltd.
- Byounghak HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE CONNECTING FRONT SIDE STRUCTURE OF SEMICONDUCTOR DEVI...
- Publication number 20230343839
- Publication date Oct 26, 2023
- Samsung Electronics Co., Ltd.
- Eun Sung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIMITED LATERAL GROWTH OF S/D EPI BY OUTER DIELECTRIC LAYER IN 3-DI...
- Publication number 20230335549
- Publication date Oct 19, 2023
- Samsung Electronics Co., Ltd.
- Inchan Hwang
- H01 - BASIC ELECTRIC ELEMENTS

Jaejik Baek

Person

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING 3D-STACKED FIELD-EFFECT TRANSISTORS...

SEMICONDUCTOR DEVICE INCLUDING SELF-ALIGNED BACKSIDE CONTACT STRUCT...

3D-STACKED TRANSISTOR STRUCTURE WITH BARRIER LAYER BETWEEN UPPER GA...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF

INTEGRATED CIRCUIT DEVICES INCLUDING STACKED FIELD EFFECT TRANSISTO...

INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION...

INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION...

INTEGRATED CIRCUIT DEVICES INCLUDING A BACK SIDE POWER DISTRIBUTION...

TRANSISTOR STACKS HAVING SPACERS, AND RELATED FABRICATION METHODS

WET RECESS FOR RU SUBTRACTIVE PROCESS

3D-STACKED SEMICONDUCTOR DEVICE HAVING DIFFERENT CHANNEL LAYER INTE...

3D-STACKED SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN INNER SPACER...

3D-STACKED SEMICONDUCTOR DEVICE INCLUDING GATE STRUCTURE FORMED OF...

3D-STACKED SEMICONDUCTOR DEVICE INCLUDING GATE STRUCTURE WITH RMG I...

VIA STRUCTURE CONNECTING FRONT SIDE STRUCTURE OF SEMICONDUCTOR DEVI...

LIMITED LATERAL GROWTH OF S/D EPI BY OUTER DIELECTRIC LAYER IN 3-DI...