Jaekyu Song

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Boise, ID, US

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Patents Grantslast 30 patents

Information Patent Grant
Contaminant control in thermocompression bonding of semiconductors...
- Patent number 11,908,828
- Issue date Feb 20, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contaminant control in thermocompression bonding of semiconductors...
- Patent number 11,410,964
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONNECTING SEMICONDUCTOR DIES THROUGH TRACES
- Publication number 20240079369
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Terrence B. McDaniel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH CAVITY-EMBEDDED CUBES AND LOGI...
- Publication number 20240063068
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTAMINANT CONTROL IN THERMOCOMPRESSION BONDING OF SEMICONDUCTORS...
- Publication number 20220320037
- Publication date Oct 6, 2022
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTAMINANT CONTROL IN THERMOCOMPRESSION BONDING OF SEMICONDUCTORS...
- Publication number 20210159206
- Publication date May 27, 2021
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS