Jaekyu SUNG

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Hwaseong-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including semiconductor chips
- Patent number 11,791,303
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Hyungu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including semiconductor chips
- Patent number 11,569,193
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Hyungu Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240179925
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Jaekyu SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE
- Publication number 20240079380
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Joonghyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK SEMICONDUCTOR PACKAGE
- Publication number 20240063155
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS
- Publication number 20230154886
- Publication date May 18, 2023
- Samsung Electronics Co., Ltd.
- Hyungu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230005884
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Minkyeong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS
- Publication number 20220130793
- Publication date Apr 28, 2022
- Samsung Electronics Co., Ltd.
- Hyungu KANG
- H01 - BASIC ELECTRIC ELEMENTS