JAEKYUNG YOO

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,165,991
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,062,639
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,923,343
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including mold layer and manufacturing method...
- Patent number 11,923,340
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including part of underfill on portion of a m...
- Patent number 11,791,282
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,594,499
- Issue date Feb 28, 2023
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,538,792
- Issue date Dec 27, 2022
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including a recessed conductive post
- Patent number 11,462,462
- Issue date Oct 4, 2022
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING MOLD LAYER AND MANUFACTURING METHOD...
- Publication number 20240203945
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- YEONGKWON KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240162194
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Jaekyung YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240088092
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Jaekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240079299
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Jaekyung YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING APPARATUS OF SEMICONDUCTOR PACKAGE
- Publication number 20230395403
- Publication date Dec 7, 2023
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230178499
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20230146621
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Jaekyung YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230088032
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- Jaekyung YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220320043
- Publication date Oct 6, 2022
- Samsung Electronics Co., Ltd.
- JAEKYUNG YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING MOLD LAYER AND MANUFACTURING METHOD...
- Publication number 20220293563
- Publication date Sep 15, 2022
- Samsung Electronics Co., Ltd.
- YEONGKWON KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220020701
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD FOR MANUFACTUR...
- Publication number 20220013474
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Jaekyung YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20210366876
- Publication date Nov 25, 2021
- Samsung Electronics Co., Ltd.
- Jaekyung YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210028098
- Publication date Jan 28, 2021
- Samsung Electronics Co., Ltd.
- JAEKYUNG YOO
- H01 - BASIC ELECTRIC ELEMENTS

JAEKYUNG YOO

Person

Patents Grantslast 30 patents

Semiconductor package

Semiconductor package and method of fabricating the same

Semiconductor package and method of fabricating the same

Semiconductor package including mold layer and manufacturing method...

Semiconductor package including part of underfill on portion of a m...

Semiconductor package

Semiconductor package and method of fabricating the same

Semiconductor packages including a recessed conductive post

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING MOLD LAYER AND MANUFACTURING METHOD...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

MOLDING APPARATUS OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING MOLD LAYER AND MANUFACTURING METHOD...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD FOR MANUFACTUR...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME