Jaemyung CHOI

Person

Niskayuna, NY, US

People

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A CONDUCTIVE VIA AND METHODS O...
- Publication number 20240355727
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- JAEMYUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING METAL STRUCTURES HAVING A CURV...
- Publication number 20230369111
- Publication date Nov 16, 2023
- Samsung Electronics Co., Ltd.
- Jaemyung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET RECESS FOR RU SUBTRACTIVE PROCESS
- Publication number 20230361032
- Publication date Nov 9, 2023
- Samsung Electronics Co., Ltd.
- Wonhyuk HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING VIA STRUCTURES HAVING A NARROW...
- Publication number 20230352400
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Tae Sun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING METAL LINES SPACED APART FROM...
- Publication number 20230352405
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Janggeun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A POWER DISTRIBUTION NETWORK A...
- Publication number 20230354570
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Inchan Hwang
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A VIA AND METHODS OF FORMING T...
- Publication number 20230352399
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Jaemyung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE OF SEMICONDUCTOR DEVICE INCLUDING METAL PATT...
- Publication number 20230343698
- Publication date Oct 26, 2023
- SAMSUNG ELECTRONICS CO,. LTD.
- Jaemyung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SPACER VIA STRUCTURE AND METHOD OF M...
- Publication number 20230343697
- Publication date Oct 26, 2023
- Samsung Electronics Co., Ltd.
- Janggeun LEE
- H01 - BASIC ELECTRIC ELEMENTS

Jaemyung CHOI

Person

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICES INCLUDING A CONDUCTIVE VIA AND METHODS O...

INTEGRATED CIRCUIT DEVICES INCLUDING METAL STRUCTURES HAVING A CURV...

WET RECESS FOR RU SUBTRACTIVE PROCESS

INTEGRATED CIRCUIT DEVICES INCLUDING VIA STRUCTURES HAVING A NARROW...

INTEGRATED CIRCUIT DEVICES INCLUDING METAL LINES SPACED APART FROM...

INTEGRATED CIRCUIT DEVICES INCLUDING A POWER DISTRIBUTION NETWORK A...

INTEGRATED CIRCUIT DEVICES INCLUDING A VIA AND METHODS OF FORMING T...

INTERCONNECT STRUCTURE OF SEMICONDUCTOR DEVICE INCLUDING METAL PATT...

SEMICONDUCTOR DEVICE INCLUDING SPACER VIA STRUCTURE AND METHOD OF M...