Jaepil Kim

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Icheon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with void prevention mechanism...
- Patent number 9,129,978
- Issue date Sep 8, 2015
- Stats Chippac Ltd.
- Jaepil Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with encapsulant containment an...
- Patent number 8,227,903
- Issue date Jul 24, 2012
- Stats Chippac Ltd.
- Hye Ran Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with molding vents
- Patent number 7,863,761
- Issue date Jan 4, 2011
- Stats Chippac Ltd.
- Dal Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULANT CONTAINMENT AN...
- Publication number 20120061859
- Publication date Mar 15, 2012
- Hye Ran Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOLDING VENTS
- Publication number 20080029873
- Publication date Feb 7, 2008
- Dal Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS