Jaeseok LEE

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Beaverton, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Chemical mechanical planarization pads with constant groove volume
- Patent number 11,938,584
- Issue date Mar 26, 2024
- CMC MATERIALS LLC
- Paul Andre Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad employing polyamine and cyclohexanedimethanol curatives
- Patent number 11,845,156
- Issue date Dec 19, 2023
- CMC Materials, Inc.
- Rui Ma
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL MECHANICAL PLANARIZATION PADS WITH CONSTANT GROOVE VOLUME
- Publication number 20240238937
- Publication date Jul 18, 2024
- CMC Materials LLC
- Paul Andre LEFEVRE
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING PADS WITH A DISULFIDE BRIDGE
- Publication number 20240100648
- Publication date Mar 28, 2024
- CMC Materials LLC
- Jaeseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL PLANARIZATION PADS WITH CONSTANT GROOVE VOLUME
- Publication number 20200353588
- Publication date Nov 12, 2020
- Cabot Microelectronics Corporation
- Paul Andre LEFEVRE
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY