JaEun Yun

Person

Ichon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of stacking semiconductor die in mo...
- Patent number 9,252,032
- Issue date Feb 2, 2016
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming protective material between semiconductor die sta...
- Patent number 9,136,144
- Issue date Sep 15, 2015
- STATS ChipPAC, Ltd.
- TaegKi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with collapsed multi-integratio...
- Patent number 8,569,882
- Issue date Oct 29, 2013
- Stats Chippac Ltd.
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming protective coating mater...
- Patent number 8,524,537
- Issue date Sep 3, 2013
- STATS ChipPAC, Ltd.
- JaEun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with heat spreader and method o...
- Patent number 8,415,204
- Issue date Apr 9, 2013
- Stats Chippac Ltd.
- JaEun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die in mo...
- Patent number 8,263,435
- Issue date Sep 11, 2012
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with triple film spacer having em...
- Patent number 7,969,023
- Issue date Jun 28, 2011
- Stats Chippac Ltd.
- Taeg Ki Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Protective Coating Mater...
- Publication number 20130256840
- Publication date Oct 3, 2013
- JaEun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking Semiconductor Die in Mo...
- Publication number 20120299174
- Publication date Nov 29, 2012
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH COLLAPSED MULTI-INTEGRATIO...
- Publication number 20120241980
- Publication date Sep 27, 2012
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BUMP BONDED DIES AND METHO...
- Publication number 20120224332
- Publication date Sep 6, 2012
- JaEun Yun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Stacking Semiconductor Die in Mo...
- Publication number 20120104624
- Publication date May 3, 2012
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protective Coating Mater...
- Publication number 20110266656
- Publication date Nov 3, 2011
- STATS ChipPAC, Ltd.
- JaEun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protective Material Betw...
- Publication number 20110115070
- Publication date May 19, 2011
- STATS ChipPAC, Ltd.
- TaegKi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SPREADER AND METHOD O...
- Publication number 20100244236
- Publication date Sep 30, 2010
- JaEun Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH TRIPLE FILM SPACER
- Publication number 20090020893
- Publication date Jan 22, 2009
- Taeg Ki Lim
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device and method of stacking semiconductor die in mo...

Method of forming protective material between semiconductor die sta...

Integrated circuit packaging system with collapsed multi-integratio...

Semiconductor device and method of forming protective coating mater...

Integrated circuit packaging system with heat spreader and method o...

Semiconductor device and method of stacking semiconductor die in mo...

Integrated circuit package system with triple film spacer having em...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Protective Coating Mater...

Semiconductor Device and Method of Stacking Semiconductor Die in Mo...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH COLLAPSED MULTI-INTEGRATIO...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BUMP BONDED DIES AND METHO...

Semiconductor Device and Method of Stacking Semiconductor Die in Mo...

Semiconductor Device and Method of Forming Protective Coating Mater...

Semiconductor Device and Method of Forming Protective Material Betw...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SPREADER AND METHOD O...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH TRIPLE FILM SPACER