JaeUng Lee

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Seoul, KR

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Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
- Publication number 20190152770
- Publication date May 23, 2019
- Amkor Technology, Inc.
- YungWoo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
- Publication number 20160221820
- Publication date Aug 4, 2016
- Amkor Technology, Inc.
- YungWoo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY