JaeYong PARK

Person

Cheonan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a semiconductor device using an adhesive layer
- Patent number 10,991,597
- Issue date Apr 27, 2021
- Samsung Electronics Co, Ltd.
- Kyung-Hak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removal apparatuses for semiconductor chips
- Patent number 10,629,564
- Issue date Apr 21, 2020
- Samsung Electronics Co., Ltd.
- JaeYong Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for laminating a tape film on a substrate and a system of...
- Patent number 10,418,259
- Issue date Sep 17, 2019
- Samsung Electronics Co., Ltd.
- Youngmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removal apparatuses for semiconductor chips
- Patent number 9,768,141
- Issue date Sep 19, 2017
- Samsung Electronics Co., Ltd.
- JaeYong Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removal apparatuses for semiconductor chips
- Patent number 8,998,068
- Issue date Apr 7, 2015
- Samsung Electronics Co., Ltd.
- JaeYong Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SHOCK ABSORBER AND ELECTRONIC DEVICE HAVING THE SAME
- Publication number 20240357737
- Publication date Oct 24, 2024
- SAMSUNG ELECTRONICS CO., LTD.
- Jaeyong PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSPECTION METHOD, SUBSTRATE PROCESSING METHOD INCLUDING THE SAME,...
- Publication number 20240201103
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Myunggeun SONG
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE USING AN ADHESIVE LAYER
- Publication number 20200303209
- Publication date Sep 24, 2020
- Samsung Electronics Co., Ltd.
- Kyung-Hak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVAL APPARATUSES FOR SEMICONDUCTOR CHIPS AND METHODS OF REMOVING...
- Publication number 20170352640
- Publication date Dec 7, 2017
- Samsung Electronics Co., Ltd.
- JaeYong PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR LAMINATING A TAPE FILM ON A SUBSTRATE AND A SYSTEM OF...
- Publication number 20170133249
- Publication date May 11, 2017
- Samsung Electronics Co., Ltd.
- YOUNGMIN KIM
- B32 - LAYERED PRODUCTS
Information Patent Application
SOLDER BALL ATTACHING APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150328707
- Publication date Nov 19, 2015
- GWANGSICK KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REMOVAL APPARATUSES FOR SEMICONDUCTOR CHIPS
- Publication number 20150179601
- Publication date Jun 25, 2015
- Samsung Electronics Co., Ltd.
- JaeYong PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE MANUFACTURING FACILITY AND METHOD OF MANUFACTURING SUBSTRATE
- Publication number 20150035184
- Publication date Feb 5, 2015
- Samsung Electronics Co., Ltd.
- Gwangsick KIM
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20130292833
- Publication date Nov 7, 2013
- Samsung Electronics Co., Ltd.
- Jae In WON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVAL APPARATUSES FOR SEMICONDUCTOR CHIPS AND METHODS OF REMOVING...
- Publication number 20130008020
- Publication date Jan 10, 2013
- JaeYong Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

JaeYong PARK

Person

Patents Grantslast 30 patents

Method of fabricating a semiconductor device using an adhesive layer

Removal apparatuses for semiconductor chips

Apparatus for laminating a tape film on a substrate and a system of...

Removal apparatuses for semiconductor chips

Removal apparatuses for semiconductor chips

Patents Applicationslast 30 patents

SHOCK ABSORBER AND ELECTRONIC DEVICE HAVING THE SAME

INSPECTION METHOD, SUBSTRATE PROCESSING METHOD INCLUDING THE SAME,...

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE USING AN ADHESIVE LAYER

REMOVAL APPARATUSES FOR SEMICONDUCTOR CHIPS AND METHODS OF REMOVING...

APPARATUS FOR LAMINATING A TAPE FILM ON A SUBSTRATE AND A SYSTEM OF...

SOLDER BALL ATTACHING APPARATUS AND METHOD OF MANUFACTURING THE SAME

REMOVAL APPARATUSES FOR SEMICONDUCTOR CHIPS

SUBSTRATE MANUFACTURING FACILITY AND METHOD OF MANUFACTURING SUBSTRATE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

REMOVAL APPARATUSES FOR SEMICONDUCTOR CHIPS AND METHODS OF REMOVING...