Jaeyoung LEE

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Substrate dividing method using an expansion tape and a roller
- Patent number 12,295,174
- Issue date May 6, 2025
- Disco Corporation
- Masamitsu Agari
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIVIDING METHOD OF SUBSTRATE
- Publication number 20230065412
- Publication date Mar 2, 2023
- Disco Corporation
- Jaeyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DIVIDING METHOD
- Publication number 20230039486
- Publication date Feb 9, 2023
- Disco Corporation
- Masamitsu AGARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED WAFER GRINDING METHOD
- Publication number 20220336221
- Publication date Oct 20, 2022
- Disco Corporation
- Jaeyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS