Jagat Shakya

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Hillsboro, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Microbump cluster probing architecture for 2.5D and 3D dies
- Patent number 12,163,982
- Issue date Dec 10, 2024
- Intel Corporation
- Jagat Shakya
- G01 - MEASURING TESTING
Information Patent Grant
Sacrificial redistribution layer in microelectronic assemblies havi...
- Patent number 11,749,628
- Issue date Sep 5, 2023
- Intel Corporation
- Adel A. Elsherbini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatuses and methods for monitoring health of probing u-bump clu...
- Patent number 11,740,282
- Issue date Aug 29, 2023
- Intel Corporation
- Jagat Shakya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial redistribution layer in microelectronic assemblies havi...
- Patent number 11,527,501
- Issue date Dec 13, 2022
- Intel Corporation
- Adel A. Elsherbini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatuses and methods for mitigating sticking of units-under-test
- Patent number 11,486,923
- Issue date Nov 1, 2022
- Intel Corporation
- Jagat Shakya
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ON DIE FLEXURE CONTROL DEVICE AND METHOD
- Publication number 20240413031
- Publication date Dec 12, 2024
- Intel Corporation
- Chandru Periasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH HYBRID BONDED DIES AND METHODS OF...
- Publication number 20240113088
- Publication date Apr 4, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROBUMP CLUSTER PROBING ARCHITECTURE FOR 2.5D AND 3D DIES
- Publication number 20230314479
- Publication date Oct 5, 2023
- Intel Corporation
- Jagat SHAKYA
- G01 - MEASURING TESTING
Information Patent Application
SACRIFICIAL REDISTRIBUTION LAYER IN MICROELECTRONIC ASSEMBLIES HAV...
- Publication number 20230074970
- Publication date Mar 9, 2023
- Intel Corporation
- Adel A. Elsherbini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUSES AND METHODS FOR MITIGATING STICKING OF UNITS-UNDER-TEST
- Publication number 20200182928
- Publication date Jun 11, 2020
- Intel Corporation
- Jagat Shakya
- G01 - MEASURING TESTING