Jagdish Saraswatula

Person

Chennai, IN

People

Patents Grantslast 30 patents

Information Patent Grant
Defect location accuracy using shape based grouping guided defect c...
- Patent number 11,119,060
- Issue date Sep 14, 2021
- KLA-Tencor Corporation
- Jagdish Chandra Saraswatula
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Inspection-guided critical site selection for critical dimension me...
- Patent number 11,035,666
- Issue date Jun 15, 2021
- KLA-Tencor Corporation
- Jagdish Chandra Saraswatula
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Guided scanning electron microscopy metrology based on wafer topogr...
- Patent number 10,957,608
- Issue date Mar 23, 2021
- KLA-Tencor Corporation
- Arpit Yati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shape metric based scoring of wafer locations
- Patent number 10,714,366
- Issue date Jul 14, 2020
- KLA-Tencor Corp.
- Saibal Banerjee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Criticality analysis augmented process window qualification sampling
- Patent number 10,503,078
- Issue date Dec 10, 2019
- KLA-Tencor Corporation
- Jagdish Chandra Saraswatula
- G01 - MEASURING TESTING
Information Patent Grant
Shape based grouping
- Patent number 9,965,848
- Issue date May 8, 2018
- KLA-Tencor Corporation
- Saibal Banerjee
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SHAPE METRIC BASED SCORING OF WAFER LOCATIONS
- Publication number 20190318949
- Publication date Oct 17, 2019
- KLA-Tencor Corporation
- Saibal Banerjee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REGION OF INTEREST AND PATTERN OF INTEREST GENERATION FOR CRITICAL...
- Publication number 20190279914
- Publication date Sep 12, 2019
- KLA-Tencor Corporation
- Jagdish Chandra Saraswatula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRITICALITY ANALYSIS AUGMENTED PROCESS WINDOW QUALIFICATION SAMPLING
- Publication number 20190072858
- Publication date Mar 7, 2019
- KLA-Tencor Corporation
- Jagdish Chandra SARASWATULA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Defect Location Accuracy Using Shape Based Grouping Guided Defect C...
- Publication number 20190072505
- Publication date Mar 7, 2019
- KLA-Tencor Corporation
- Jagdish Chandra SARASWATULA
- G01 - MEASURING TESTING
Information Patent Application
INSPECTION-GUIDED CRITICAL SITE SELECTION FOR CRITICAL DIMENSION ME...
- Publication number 20190041202
- Publication date Feb 7, 2019
- KLA-Tencor Corporation
- Jagdish Chandra SARASWATULA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Guided Metrology Based on Wafer Topography
- Publication number 20180315670
- Publication date Nov 1, 2018
- KLA-Tencor Corporation
- Arpit Yati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHAPE BASED GROUPING
- Publication number 20170186151
- Publication date Jun 29, 2017
- KLA-Tencor Corporation
- Saibal Banerjee
- G06 - COMPUTING CALCULATING COUNTING

Jagdish Saraswatula

Person

Patents Grantslast 30 patents

Defect location accuracy using shape based grouping guided defect c...

Inspection-guided critical site selection for critical dimension me...

Guided scanning electron microscopy metrology based on wafer topogr...

Shape metric based scoring of wafer locations

Criticality analysis augmented process window qualification sampling

Shape based grouping

Patents Applicationslast 30 patents

SHAPE METRIC BASED SCORING OF WAFER LOCATIONS

REGION OF INTEREST AND PATTERN OF INTEREST GENERATION FOR CRITICAL...

CRITICALITY ANALYSIS AUGMENTED PROCESS WINDOW QUALIFICATION SAMPLING

Defect Location Accuracy Using Shape Based Grouping Guided Defect C...

INSPECTION-GUIDED CRITICAL SITE SELECTION FOR CRITICAL DIMENSION ME...

Guided Metrology Based on Wafer Topography

SHAPE BASED GROUPING