Jagen KRISHNAN

Person

Muar, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Selective plating of semiconductor package leads
- Patent number 10,651,109
- Issue date May 12, 2020
- Infineon Technologies AG
- Syahir Abd Hamid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a matrix composite layer and workpiece with a ma...
- Patent number 10,457,001
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly for handling a semiconductor die and method of handling a...
- Patent number 10,096,508
- Issue date Oct 9, 2018
- Infineon Technologies AG
- Ronald Paramio Joves
- B32 - LAYERED PRODUCTS
Information Patent Grant
Embedding additive particles in encapsulant of electronic device
- Patent number 9,852,918
- Issue date Dec 26, 2017
- Infineon Technologies AG
- Peh Hean Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Primer composition, method of forming a primer layer on a semicondu...
- Patent number 9,540,539
- Issue date Jan 10, 2017
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Selective Plating of Semiconductor Package Leads
- Publication number 20200020607
- Publication date Jan 16, 2020
- Syahir Abd Hamid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Plating of Semiconductor Package Leads
- Publication number 20200020621
- Publication date Jan 16, 2020
- Syahir Abd Hamid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for Forming a Matrix Composite Layer and Workpiece With a Ma...
- Publication number 20180297301
- Publication date Oct 18, 2018
- INFINEON TECHNOLOGIES AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedding additive particles in encapsulant of electronic device
- Publication number 20160064298
- Publication date Mar 3, 2016
- INFINEON TECHNOLOGIES AG
- Peh Hean TEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY FOR HANDLING A SEMICONDUCTOR DIE AND METHOD OF HANDLING A...
- Publication number 20160049325
- Publication date Feb 18, 2016
- INFINEON TECHNOLOGIES AG
- Ronald PARAMIO JOVES
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
PRIMER COMPOSITION, METHOD OF FORMING A PRIMER LAYER ON A SEMICONDU...
- Publication number 20150344730
- Publication date Dec 3, 2015
- INFINEON TECHNOLOGIES AG
- Swee Kah LEE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Jagen KRISHNAN

Person

Patents Grantslast 30 patents

Selective plating of semiconductor package leads

Method for forming a matrix composite layer and workpiece with a ma...

Assembly for handling a semiconductor die and method of handling a...

Embedding additive particles in encapsulant of electronic device

Primer composition, method of forming a primer layer on a semicondu...

Patents Applicationslast 30 patents

Selective Plating of Semiconductor Package Leads

Selective Plating of Semiconductor Package Leads

Method for Forming a Matrix Composite Layer and Workpiece With a Ma...

Embedding additive particles in encapsulant of electronic device

ASSEMBLY FOR HANDLING A SEMICONDUCTOR DIE AND METHOD OF HANDLING A...

PRIMER COMPOSITION, METHOD OF FORMING A PRIMER LAYER ON A SEMICONDU...