Jaimal Mallory Williamson

Person

McKinney, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package heat dissipation including a die attach film
- Patent number 12,199,008
- Issue date Jan 14, 2025
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having porous dielectric layer
- Patent number 11,973,017
- Issue date Apr 30, 2024
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming package substrate with partially recessed capacitor
- Patent number 11,804,382
- Issue date Oct 31, 2023
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate with partially recessed capacitor
- Patent number 11,289,412
- Issue date Mar 29, 2022
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate with CTE matching barrier ring around microvias
- Patent number 11,270,955
- Issue date Mar 8, 2022
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via integrity and board level reliability testing
- Patent number 11,081,406
- Issue date Aug 3, 2021
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having metal posts for stress relief at flatn...
- Patent number 10,748,863
- Issue date Aug 18, 2020
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe having organic, polymerizable photo-imageable adhesion layer
- Patent number 10,672,692
- Issue date Jun 2, 2020
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate having stress-absorbing surface layer
- Patent number 10,490,515
- Issue date Nov 26, 2019
- Texas Instruments Incorporated
- Jaimal M. Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate having stress-absorbing surface layer
- Patent number 10,347,589
- Issue date Jul 9, 2019
- Texas Instruments Incorporated
- Jaimal M. Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming leadframe having organic, polymerizable photo-i...
- Patent number 9,934,989
- Issue date Apr 3, 2018
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate having stress-absorbing surface layer
- Patent number 9,673,065
- Issue date Jun 6, 2017
- Texas Instruments Incorporated
- Jaimal M. Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of manufacture
- Patent number 9,281,269
- Issue date Mar 8, 2016
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire-based methodology of widening the pitch of semiconductor chip...
- Patent number 8,674,504
- Issue date Mar 18, 2014
- Texas Systems Incorporated
- Charles Anthony Odegard
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL FILLING AND TOP METAL SPACING FOR DIE CRACK MITIGATION
- Publication number 20250006660
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yutaka Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTRUDED SCRIBE FEATURE DELAMINATION MITIGATION
- Publication number 20240332213
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING POROUS DIELECTRIC LAYER
- Publication number 20240282693
- Publication date Aug 22, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE EMI SHIELDING WITH GROUNDED MOLD INTERCON...
- Publication number 20240178154
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL PACKAGE SUBSTRATE WITH STAIR SHAPED SUBSTRATE TRACES
- Publication number 20230207435
- Publication date Jun 29, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING POROUS DIELECTRIC LAYER
- Publication number 20230118218
- Publication date Apr 20, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HEAT DISSIPATION
- Publication number 20220319954
- Publication date Oct 6, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory WILLIAMSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH CTE MATCHING BARRIER RING AROUND MICROVIAS
- Publication number 20220254735
- Publication date Aug 11, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH PARTIALLY RECESSED CAPACITOR
- Publication number 20220223509
- Publication date Jul 14, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED MOLD COMPOUND THERMAL CONDUCTIVITY
- Publication number 20220122936
- Publication date Apr 21, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory WILLIAMSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH PARTIALLY RECESSED CAPACITOR
- Publication number 20200294899
- Publication date Sep 17, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH IMPROVED DIE PAD AND SOLDER MASK...
- Publication number 20200251436
- Publication date Aug 6, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH CTE MATCHING BARRIER RING AROUND MICROVIAS
- Publication number 20200176396
- Publication date Jun 4, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA INTEGRITY AND BOARD LEVEL RELIABILITY TESTING
- Publication number 20190393106
- Publication date Dec 26, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Substrate Having Stress-Absorbing Surface Layer
- Publication number 20190279944
- Publication date Sep 12, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal M. Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING METAL POSTS FOR STRESS RELIEF AT FLATN...
- Publication number 20180190606
- Publication date Jul 5, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FORMING LEADFRAME HAVING ORGANIC, POLYMERIZABLE PHOTO-I...
- Publication number 20180096859
- Publication date Apr 5, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe Having Organic, Polymerizable Photo-Imageable Adhesion Layer
- Publication number 20180096860
- Publication date Apr 5, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Substrate Having Stress-Absorbing Surface Layer
- Publication number 20170229405
- Publication date Aug 10, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal M. Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE HAVING STRESS-ABSORBING SURFACE LAYER
- Publication number 20150021762
- Publication date Jan 22, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal M. Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20140138822
- Publication date May 22, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire-Based Methodology of Widening the Pitch of Semiconductor Chip...
- Publication number 20130307141
- Publication date Nov 21, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Charles Anthony Odegard
- H01 - BASIC ELECTRIC ELEMENTS

Jaimal Mallory Williamson

Person

Patents Grantslast 30 patents

Package heat dissipation including a die attach film

Package substrate having porous dielectric layer

Method of forming package substrate with partially recessed capacitor

Package substrate with partially recessed capacitor

Package substrate with CTE matching barrier ring around microvias

Via integrity and board level reliability testing

Semiconductor devices having metal posts for stress relief at flatn...

Leadframe having organic, polymerizable photo-imageable adhesion layer

Semiconductor substrate having stress-absorbing surface layer

Semiconductor substrate having stress-absorbing surface layer

Process for forming leadframe having organic, polymerizable photo-i...

Semiconductor substrate having stress-absorbing surface layer

Integrated circuit package and method of manufacture

Wire-based methodology of widening the pitch of semiconductor chip...

Patents Applicationslast 30 patents

METAL FILLING AND TOP METAL SPACING FOR DIE CRACK MITIGATION

PROTRUDED SCRIBE FEATURE DELAMINATION MITIGATION

PACKAGE SUBSTRATE HAVING POROUS DIELECTRIC LAYER

ELECTRONIC DEVICE PACKAGE EMI SHIELDING WITH GROUNDED MOLD INTERCON...

MULTILEVEL PACKAGE SUBSTRATE WITH STAIR SHAPED SUBSTRATE TRACES

PACKAGE SUBSTRATE HAVING POROUS DIELECTRIC LAYER

PACKAGE HEAT DISSIPATION

PACKAGE SUBSTRATE WITH CTE MATCHING BARRIER RING AROUND MICROVIAS

PACKAGE SUBSTRATE WITH PARTIALLY RECESSED CAPACITOR

ENHANCED MOLD COMPOUND THERMAL CONDUCTIVITY

PACKAGE SUBSTRATE WITH PARTIALLY RECESSED CAPACITOR

SEMICONDUCTOR DEVICE PACKAGE WITH IMPROVED DIE PAD AND SOLDER MASK...

PACKAGE SUBSTRATE WITH CTE MATCHING BARRIER RING AROUND MICROVIAS

VIA INTEGRITY AND BOARD LEVEL RELIABILITY TESTING

Semiconductor Substrate Having Stress-Absorbing Surface Layer

SEMICONDUCTOR DEVICES HAVING METAL POSTS FOR STRESS RELIEF AT FLATN...

PROCESS FOR FORMING LEADFRAME HAVING ORGANIC, POLYMERIZABLE PHOTO-I...

Leadframe Having Organic, Polymerizable Photo-Imageable Adhesion Layer

Semiconductor Substrate Having Stress-Absorbing Surface Layer

SEMICONDUCTOR SUBSTRATE HAVING STRESS-ABSORBING SURFACE LAYER

INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURE

Wire-Based Methodology of Widening the Pitch of Semiconductor Chip...